Bump structure and method for making the same
AssigneeNEC Corporation
InventorsKoji Soejima, Naoji Senba
Life of this patent
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Abstract
Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.
Claims85
A contact structure for electrically connecting a first member and a second member, comprising:
- a first substrate;
- an first electrode disposed on a surface of the first substrate;
- and
- a bump structure connected to a surface of the first electrode, wherein the bump structure comprises a conductive shell defining an interior volume which contains only a gas, and wherein the bump structure is supported only by its connection to the first electrode.
A contact structure for electrically connecting a first member and a second member, comprising:
- a first substrate;
- a second substrate;
- an first electrode disposed on a surface of the first substrate;
- a second electrode disposed on the second substrate;
- and
- a bump structure connected to both a surface of the first electrode and a surface of the second electrode, wherein the bump structure comprises a conductive shell defining an interior volume which contains only a gas, and wherein the bump structure is supported only by its connection to the first and second electrodes.
Dependencies are inferred from the claim text.