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US 6,307,008 B1Granted
Polyimide for high temperature adhesive
AssigneeSaehan Industries Inc.
InventorsKyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang, Jeong Min Kweon
Life of this patent
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Abstract
A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures. The polyimide adhesive is based on the polyimide represented by the following formula II which can be prepared through the thermal or chemical imidization of the polyamic acid represented by the following formula I:
Claims5
A polyamic acid for an adhesive, represented by the following Formula:
- wherein, R is a tetravalent organic group selected from the group consisting of:
- R1 is a divalent organic group selected from the group consisting of:
- R2 is a trivalent or tetravalent organic group selected from the group consisting of:
- R3 is a divalent organic group represented by the following formula:
- wherein, R4 is an alkylene group containing 1-20 carbon atoms and n′ is the number of a recurring unit;
- and l, m and n each are molar numbers of the corresponding recurring units under the condition that l/(m+n) ranges from 99.985/0.015 to 80/15 as expressed in terms of molar ratio and m/(l+n) is from 1/2000 to 500/1 as expressed in terms of molar ratio.
3 more elements
A polyimide for an adhesive, represented by the following Formula II:
Dependencies are inferred from the claim text.