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US 6,306,957 B1Granted
Thermal conductive silicone rubber compositions and making method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsAkio Nakano, Hiroshi Takei, Takeshi Hashimoto, Yuuki Sakurai
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Abstract
An organopolysiloxane, a hydrolyzable group-bearing methylpolysiloxane, a thermal conductive filler, and a curing agent are blended to form a silicone rubber composition which is minimized in viscosity or plasticity increase and remains effectively moldable and workable even when loaded with a large amount of the thermal conductive filler. It cures into a silicone rubber part having a high thermal conductivity.
Claims12
A thermal conductive silicone rubber composition comprising
- (A) 2 to 69.9% by volume of an organopolysiloxane of the following average compositional formula (1):
- R1aSiO(4-a)/2 (1)
- wherein R1 is independently a substituted or unsubstituted monovalent hydrocarbon group and letter a is a positive number of 1.90 to 2.05,
- (B) 0.1 to 50% by volume of a hydrolyzable group-bearing methylpolysiloxane of the following general formula (3):
- wherein R3 is an alkoxy or acyloxy group of 1 to 4 carbon atoms, and letter p is an integer of 5 to 100,
- (C) 30 to 90% by volume of a thermal conductive filler, with the proviso that components (A), (B) and (C) combined total 100% by volume and the amount of components (A) and (B) combined is 10 to 70% by volume, and
- (D) a sufficient amount of a curing agent to effect curing.
4 more elements
Dependencies are inferred from the claim text.