Adhesive resin composition and heat-shrinkable articles made by using the same

Abstract

A hot-melt adhesive comprises a resin composition comprising (a) from 0.1 to 50 parts by weight of a polyolefin resin obtained by copolymerizing 80% by weight or more of a non-polar α-olefin with 20% by weight or less in total of a monomer containing 5% by weight or more of a carboxyl group and a polar α-olefin, or with 20% by weight or less in total of a monomer containing 0.5% by weight or more of an acid anhydride group and a polar α-olefin, (b) from 0 to 80 parts by weight of a copolymer of ethylene and a non-polarα-olefin, or a polyolefin resin containing 20% by weight or less of a polar α-olefin, and (c) from 10 to 90 parts by weight of a polyamide, provided that the total amount of the components (a), (b) and (c) is 100 parts by weight, the resin composition having a melt index of 5 g/10 min or more and less than 500 g/10 min. The hot-melt adhesive resin composition of the invention has excellent adhesiveness to both non-polar and polar adherends. A heat recoverable article using the hot-melt adhesive is valuable for processing a joint and an end of electric cables.

Dependencies are inferred from the claim text.