Thermosetting resin compositions for build-up method
AssigneeSumitomo Chemical Company, Limited
InventorsToshiaki Hayashi, Nobuyuki Nakajima, Noriaki Saito
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Abstract
Provided is a thermosetting resin composition for build-up method comprising (A) an epoxy resin having two or more glycidyl groups, (B) a curing agent for epoxy resin, (C) a poly(ether sulfone) and (D) an inorganic filler. The thermosetting resin composition does not deteriorate the processability such as that found in the conventional one and gives a cured product excellent in low-thermal expansion and low-water absorption.
Claims11
An insulation layer having a thickness of 10 to 300 μm used for build-up method, wherein the layer is formed by curing a thermosetting resin composition comprising (A) an epoxy resin having two or more glycidyl groups, (B) a curing agent for epoxy resin, (C) a poly(ether sulfone) and (D) an inorganic filler.
An insulation layer having a thickness of 10 to 300 μm used for build-up method, wherein the layer is formed by curing a thermosetting resin composition comprising (A) an epoxy resin having two or more glycidyl groups, (B) a polyhydric phenol type curing agent for epoxy resin and (C) a poly(ether sulfone).
Dependencies are inferred from the claim text.