Connection component and method of making same
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, Joseph Fjeslstad, John W. Smith
Life of this patent
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Abstract
A method of making a connection component for a microelectronic element includes providing a sheet comprising an electrically conductive layer, a photoresist layer overlying the conductive layer and a photoimageable dielectric layer disposed under the conductive layer. The method includes lithographically forming at least one opening in the photoresist layer to uncover a portion of the conductive layer, forming a plurality of circuit features from the conductive layer by removing the uncovered portion of the conductive layer, at least some of the circuit features being leads, and lithographically forming at least one aperture in the photoimageable dielectric layer.
Claims26
A method of making a connection component for a microelectronic element, comprising:
- A. providing a composite sheet comprising;
- 1) an electrically conductive layer having a first surface and a bottom surface opposite the top surface;
- 2) a photoresist layer disposed on the first surface of the conductive layer;
- and
- 3) a photoimageable dielectric layer disposed on the bottom surface of the conductive layer;
- B. lithographically forming at least one opening in the photoresist layer to uncover a portion of the conductive layer;
- C. forming a plurality of circuit features from the conductive layer by removing the uncovered portion of the conductive layer, wherein at least some of the circuit features are leads;
- and
- D. lithograpically forming at least one aperture in the phototimageable dielectric layer.
Dependencies are inferred from the claim text.