Method of reworkably removing a fluorinated polymer encapsulant
AssigneeTeravicta Technologies, Inc.
InventorBrent D. Lunceford
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Abstract
The present invention provides an improved fluorinated polymer encapsulant for protectively coating electronic devices in an electronic device module. Also provided is a method for applying and reworkably removing the same to and from the electronic device module. In one embodiment, a coating of a fluorinated polymer solution is applied to at least a portion of an electronic device module. The module is then baked to operably fix to it the fluorinated polymer coating.
Claims15
A method for reworkably removing fixed fluorinated polymer coating from an electronic device module, the method comprising:
- (a) dissolving the fluorinated polymer with a solvent;
- and
- (b) sufficiently removing the dissolved fluorinated polymer coating from the module in order to rework it,
- wherein substantially no chemical reaction occurs between said fluorinated polymer and said solvent when said fluorinated polymer is dissolved with said solvent.
A method for reworkably removing fixed fluorinated polymer coating from an electronic device module, the method comprising:
- (a) dissolving the fluorinated polymer with a solvent that will not adversely react with said electronic device module;
- and
- (b) sufficiently removing the dissolved fluorinated polymer coating from the module in order to rework it.
A method for reworkably removing fixed fluorinated polymer coating from an electronic device module, the method comprising:
- (a) dissolving the fluorinated polymer with a solvent;
- and
- (b) sufficiently removing the dissolved fluorinated polymer coating from the module in order to rework it,
- wherein said solvent does not break crosslinks in said fixed fluorinated polymer coating.
Dependencies are inferred from the claim text.