Tape under frame for conventional-type IC package assembly
OwnerDavid J. Corisis, Larry D. Kinsman +1inventors
InventorsDavid J. Corisis, Larry D. Kinsman, Jerry M. Brooks
Life of this patent
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Abstract
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.
Claims20
A method of assembling a semiconductor device and a lead frame comprising:
- forming a lead frame having a plurality of lead fingers, each lead finger of the plurality of lead fingers having a bonding end, said plurality of lead fingers forming an opening at least the size of an attachment surface of a semiconductor device, the lead frame having no die paddle for supporting a semiconductor device thereon;
- forming a segment of tape having a shape to fit over at least the bonding end of each lead finger of the plurality of lead fingers of said lead frame forming said opening, said segment of tape extending between said plurality of lead fingers across said opening, said segment of tape having a thermosetting adhesive located in a portion thereof;
- adhesively attaching said segment of tape to at least the bonding end of each lead finger of the plurality of lead fingers of said lead frame, the segment of tape providing an attachment location for a semiconductor device through the use of said thermosetting adhesive;
- and
- adhesively attaching a semiconductor device to at least a portion of the segment of tape at the location for the attachment of a semiconductor device using the thermosetting adhesive located on a portion of segment of tape.
A method of assembling a semiconductor device and a lead frame comprising:
- forming a lead frame having a plurality of lead fingers, each lead finger of the plurality of lead fingers having an end forming an opening between said ends of said plurality of lead fingers of said lead frame at least the size of an attachment surface of a semiconductor device;
- forming at least two tape segments shaped to fit over a portion of the ends of the plurality of lead fingers of said lead frame, said segments extending across said opening having a size at least the size of said semiconductor device;
- and
- adhesively attaching said plurality of tape segments to said portion of the ends of the plurality of lead fingers, the at least two tape segments being spaced to define at least one opening between the at least two tape segments providing an attachment location for a semiconductor device therein.
Dependencies are inferred from the claim text.