Stress reducing lead-frame for plastic encapsulation

Abstract

A method for attaching an integrated circuit die to a mounting structure, the method having the steps of: forming a mounting structure having a die pad and at least one spreader; applying an adhesive to the die pad and the at least one spreader of the mounting structure; and attaching the integrated circuit die to the adhesive, wherein the at least one spreader is between the die pad and the integrated circuit die. Also, an integrated circuit package having: a mounting structure having a die pad and at least one spreader; an adhesive adhered to the die pad and the at least one spreader of the mounting structure; and an integrated circuit die adhered to the adhesive, wherein the at least one spreader is between the die pad and the integrated circuit die. Finally, a mounting structure for an integrated circuit die, the mounting structure comprising: a die pad for supporting the integrated circuit die; and at least one spreader for supporting the integrated circuit die at a distance from the die pad.

Dependencies are inferred from the claim text.