Method of forming a flip chip assembly, and a flip chip assembly formed by the method

A method for forming a flip-chip assembly, said method comprising the steps of:

• soldering a multiplicity of contact pads on a surface of said flip-chip to a respective multiplicity of contact pads on a surface of a chip carrier forming a space between said flip-chip surface and said chip carrier surface;
• after the soldering step, plasma etching said flipchip surface and said chip carrier through said space;
• and
• after the plasma etching step, applying an underfill material within said space to adhesively bond said flip-chip surface to said chip carrier surface.

A method for forming a flip-chip assembly, said method comprising the steps of:

• plasma etching a surface of said flip-chip, said plasma etching chemically modifying said surface of said flip-chip while causing less than 100 angstroms or roughening;
• after the plasma etching step, soldering a multiplicity of contact pads on said surface of said flip-chip to a respective multiplicity of contact pads on a surface of a chip carrier forming a space between said flip-chip surface and said chip carrier surface;
• and
• after the soldering step, applying an underfill material within said space to adhesively bond said flip-chip surface to said chip carrier surface.

A method for forming a flip-chip assembly, said method comprising the steps of:

• plasma etching a surface of a chip carrier, said chip carrier surface comprising an organic layer with an inorganic filler material, said plasma etching step exposing some of said filler material;
• after the plasma etching step, soldering a multiplicity of contact pads on a surface of said flip-chip to a respective multiplicity of contact pads on said surface of said chip carrier forming a space between said flip-chip surface and said chip carrier surface;
• and
• after the soldering step, applying an underfill material within said space to adhesively bond said flip-chip surface to said chip carrier surface.