Semiconductor packaging metal lid
AssigneesSumitomo Metal (SMI) Electronics Devices Inc., Senju Metal Industry Co., Ltd.
InventorsTetsuya Yamamoto, Shigeki Kawamura, Sanae Taniguchi
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Abstract
A metal lid for use in hermetic sealing of a semiconductor package comprises a lid body comprising a metal plate having a solder layer secured to the entire surface of the metal lid by cladding. The lid is placed in position on a substrate and can seal the resulting package by heating to melt the solder layer. The lid can be readily mass-produced and can seal the package with high seal reliability and without deposition of solder balls on the inner wall of the package.
Claims12
A semiconductor packaging metal lid suitable for use in hermetic sealing of a semiconductor package, comprising a metal plate having a solder layer secured to the metal plate by cladding prior to formation of the hermetic seal.
A semiconductor packaging assembly comprising a substrate on which a semiconductor element is to be mounted, and a metal lid having a solder layer for sealing, wherein the metal lid comprises a metal plate having a solder layer secured to the metal plate by cladding prior to formation of the seal between the metal lid and the substrate.
Dependencies are inferred from the claim text.