Article comprising oxide-bondable solder
AssigneeAgere Systems Guardian Corp.
InventorsSungho Jin, Hareesh Mavoori, Ainissa G Ramirez
Life of this patent
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Abstract
The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.
Claims20
An article comprising a solder composition that comprises 0.1 to 5 wt. % of one or more rare earth elements, and at least 0.1 wt. % Au, Ag, or mixtures thereof, based on the weight of the total composition, wherein the amount of Au, Ag, or mixtures thereof is sufficient to provide solubility for at least a portion of the rare earth elements, and wherein the solder composition comprises a base solder material consisting of Au, Ag, or mixtures thereof, or consisting of one or more solder materials other than Au and Ag, or consisting of Au, Ag, or mixtures thereof and one or more solder materials other than Au and Ag.
An article comprising a solder composition that comprises 0.01 to 20 wt. % of one or more rare earth elements, and 0.1 to 30 wt. % Au, Ag, or mixtures thereof, based on the weight of the total composition, wherein the amount of Au, Ag, or mixtures thereof is sufficient to provide solubility for at least a portion of the rare earth elements, and wherein the solder composition comprises a base solder material consisting of Au, Ag, or mixtures thereof, or consisting of one or more solder materials other than Au and Ag, or consisting of Au, Ag, or mixtures thereof and one or more solder materials other than Au and Ag.
An article comprising a solder composition that consists essentially of a base solder material of Sn and at least 0.1 wt. % of Au or Ag, and 0.01 to 20 wt. % of one or more rare earth elements.
An article comprising a solder composition that comprises 0.01 to 20 wt. % of one or more rare earth elements, and at least 0.1 wt. % Au, Ag, or mixtures thereof, based on the weight of the total composition, wherein the amount of Au, Ag, or mixtures thereof is sufficient to provide solubility for at least a portion of the rare earth elements, wherein the solder composition comprises a base solder material consisting of Au, Ag, or mixtures thereof, or consisting of one or more solder materials other than Au and Ag, or consisting of Au, Ag, or mixtures thereof and one or more solder materials other than Au and Ag, and wherein the solder is bonded to at least one oxide surface in the absence of any intermediate metallizing layers.
A process for fabricating an article, comprising the step of bonding two or more components with a solder composition that comprises 0.1 to 5 wt. % of one or more rare earth elements, and at least 0.1 wt. % Au, Ag, or mixtures thereof, based on the weight of the total composition, wherein the amount of Au, Ag, or mixtures thereof is sufficient to provide solubility for at least a portion of the rare earth elements, and wherein the solder composition comprises a base solder material consisting of Au, Ag, or mixtures thereof, or consisting of one or more solder materials other than Au and Ag, or consisting of Au, Ag, or mixtures thereof and one or more solder materials other than Au and Ag.
A process for fabricating an article, comprising the step of bonding two or more components with a solder composition that comprises 0.01 to 20 wt. % of one or more rare earth elements, and 0.1 to 30 wt. % Au, Ag, or mixtures thereof, based on the weight of the total composition, wherein the amount of Au, Ag, or mixtures thereof is sufficient to provide solubility for at least a portion of the rare earth elements, and wherein the solder composition comprises a base solder material consisting of Au, Ag, or mixtures thereof, or consisting of one or more solder materials other than Au and Ag, or consisting of Au, Ag, or mixtures thereof and one or more solder materials other than Au and Ag.
A process for fabricating an article, comprising the step of bonding two or more components with a solder composition that comprises 0.01 to 20 wt. % of one or more rare earth elements, and at least 0.1 wt. % Au, Ag, or mixtures thereof, based on the weight of the total composition, wherein the amount of Au, Ag, or mixtures thereof is sufficient to provide solubility for at least a portion of the rare earth elements, wherein the solder composition comprises a base solder material consisting of Au, Ag, or mixtures thereof, or consisting of one or more solder materials other than Au and Ag, or consisting of Au, Ag, or mixtures thereof and one or more solder materials other than Au and Ag, wherein at least one of the components comprises an oxide surface, and wherein the bonding is performed in the absence of an intermediate metallizing layer.
Dependencies are inferred from the claim text.