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AssigneesHitachi, Ltd., Hitachi Chemical Company, Ltd.
InventorsSatoru Amou, Masao Suzuki, Tokihito Suwa, Mineo Kawamoto, Akio Takahashi, Masanori Nemoto, Hiroyuki Fukai, Mitsuo Yokota, Shiro Kobayashi, Masashi Miyazaki
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A multilayer circuit board having a resolution in the range of 25-80 μm, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220° C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
A multilayer circuit board with blind via-holes between layers, the via-holes having a resolution in the range of 25-80 μm and an aspect ratio in the range of 2.0-0.6, for making the layers accessible to each other,
A multilayer circuit board with blind via-holes between layers, the via-holes having a resolution in the range of 25-80μm and an aspect ratio in the range of 2.0-0.6, for making the layers accessible to each other,
Dependencies are inferred from the claim text.