US 6,306,275 B1 · Method for controlling organic micelle size in nickel-plating solution

Abstract

A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish characteristics such as roughness depth are maintained within desired limits. The process involves steps of removing a portion of the electrolyte from the electroplating bath, filtering the alkylene oxide from the electrolyte removed from the electroplating bath, adding alkylene oxide to the electroplating bath, and returning the filtered electrolyte to the electroplating bath. The process removes larger alkylene oxide micelles from the electrolyte and replaces them with smaller micelles to maintain a desired micelle size distribution.

Claims18

Dependent claims

A process for controlling the micelle size distribution of a dispersion in an operating plating bath, comprising:

(a) providing a plating bath containing an electrolyte, the electrolyte containing a water soluble nickel salt, a primary polishing agent, and an alkylene oxide adduct;
and
(b) continuously or intermittently performing the following steps during operation of the plating bath:
(i) removing a portion of electrolyte from the electroplating bath;
(ii) separating the alkylene oxide adduct from the electrolyte that was removed from the electroplating bath;
(iii) adding alkylene oxide adduct to the electroplating bath;
and
(iv) returning the electrolyte that was removed from the electroplating bath back to the electroplating bath.

5 more elements

An electroplating process comprising:

(a) providing a plating bath containing an electrolyte, the electrolyte containing a water soluble nickel salt, a primary polishing agent and an alkylene oxide adduct;
and
(b) continuously or intermittently performing the following steps while passing an electric current from a substrate that is to be electroplated through the electrolyte to an electrode:
(i) removing a portion of the electrolyte from the electroplating bath;
(ii) separating the alkylene oxide adduct from the electrolyte removed from the electroplating bath;
(iii) adding alkylene oxide adduct to the electroplating bath;
and
(iv) returning the electrolyte that was removed from the electroplating bath back to the electroplating bath.

5 more elements

Dependencies are inferred from the claim text.

Method for controlling organic micelle size in nickel-plating solution

Life of this patent

Method for controlling organic micelle size in nickel-plating solution

Life of this patent

Abstract

Claims18