Method for making electrodeposition blades

Abstract

Disclosed are an apparatus and method for making both coarse-sided electrodeposition blades for cutting, for instance, semiconductor wafers. The apparatus comprises at least an electrolyte bath containing an electrodeposition object and pulverized grindstone in the electrolyte, an electrolytic metal immersed in the electrolyte, and an electric source whose positive and negative terminals are connected to the electrolytic metal and electrodeposition object, and the surface of the electrodeposition object, on which a required electro-deposit is to be formed, is of a predetermined coarseness. The method comprises at least the steps of: forming minute irregularities on the surface of the electrodeposition object, on which a required electro-deposit is to be formed, thus providing a predetermined coarseness on the electrodeposition object; immersing the electrodeposition object in the electrolyte to grow an electro-deposit on the surface of the electrodeposition object by making electric current to flow in the electrolyte; and taking the electrodeposition object having the electro-deposit formed on its surface away from the electrolyte bath to remove a selected part or the whole of the electrodeposition object, thus leaving the electro-deposit.

Dependencies are inferred from the claim text.