Method for making smart cards, and resulting cards
AssigneeGemplus
InventorVincent Permingeat
Life of this patent
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Abstract
A method for making cards with an electronic module is disclosed. The method comprises the steps of providing a card body (1) having a cavity (3, 4), an electronic module (5) shaped to fit said cavity, and a cyanoacrylate adhesive, depositing said adhesive in said cavity, inserting said module into the cavity in a substantially centered position, and pressing said adhesive between the card and the module. According to the method, said adhesive is deposited in an amount sufficient to cover an adhesion surface constituting 50-100% of the surface of said cavity, after pressing, at a temperature of 15-30° C. and at a humidity level of 50-75%. The cards produced by carrying out the method are also disclosed.
Claims13
Method for making electronic module cards of the type having a card body with a cavity, an electronic module whose dimensions fit into said cavity, and a cyanoacrylate glue, and having steps wherein said glue is deposited in said cavity, said module is inserted into the cavity in a substantially centered position, and said glue is pressed between the body and the module, characterized in that:
- said glue is deposited in a quantity enablingy only a partial gluing area of at least 50% of the area of said cavity after pressing, at a temperature of 15 to 30° C. and a relative humidity of 50 to 75%;
- and
- said quantity of glue is deposited in a pattern with a central dot and at least four lateral dots wherein the central dot is larger than each of the at least four lateral dots.
Method for making electronic module cards of the type having a card body with a cavity, an electronic module whose dimensions fit into said cavity, and a cyanoacrylate glue, and having steps wherein said glue is deposited in said cavity, said module is inserted into the cavity in a substantially centered position, and said glue is pressed between the body and the module, characterized in that:
- said glue is deposited in a quantity enabling only a partial gluing area of at least 50% of the area of said cavity, after pressing, at a temperature of 15 to 30° C. and a relative humidity of 50 to 75%;
- and
- said quantity of glue is deposited in the form of at least five glue dots, a central dot composed of a dot weighing between 0.002 and 0.004 gram, and at least four lateral dots, each weighing between 0.0005 and 0.0015 gram.
Method for making electronic module cards of the type having a card body with a cavity, an electronic module whose dimensions fit into said cavity, and a cyanoacrylate glue, and having steps wherein said glue is deposited in said cavity, said module is inserted into the cavity in a substantially centered position, and said glue is pressed between the body and the module, characterized in that:
- said glue is deposited in a quantity enabling only a partial gluing area of at least 50% of the area of said cavity, after pressing, at a temperature of 15 to 30° C. and a relative humidity of 50 to 75%;
- and
- said quantity of glue is deposited in the form of at least five glue dots, comprising a central dot, and at least four lateral dots, the central dot weighing approximately three times the weight of each of said at least four lateral dots.
Method for making electronic module cards of the type having a card body with a cavity, an electronic module whose dimensions fit into said cavity, and a cyanoacrylate glue, and having steps wherein said glue is deposited in said cavity, said module is inserted into the cavity in a substantially centered position, and said glue is pressed between the body and the module, characterized in that:
- said glue is deposited in a quantity enablingy only a partial gluing area of at least 50% of the area of said cavity after pressing, at a temperature of 15 to 30° C. and a relative humidity of 50 to 75%;
- said quantity of glue is deposited in a pattern with a central dot and at least four lateral dots wherein the central dot is larger than each of the at least four lateral dots;
- and
- the pressing is effected by a blanket with a central hole, which is disposed between the module and the pressing means, whereby pressing is done only at the periphery of said module and thus reducing the risk of introducing mechanical stress to the module that could damage its semiconductor chip or its connecting leads.
Dependencies are inferred from the claim text.