Dressing tool for the surface of an abrasive cloth and its production process
AssigneeNEC Corporation
InventorKouji Torii
Life of this patent
Estimating the term…
Abstract
Onto the surface of a dressing tool for removing the clogging of an abrasive cloth, diamond grains of plural groups each having a different average particle diameter are subjected to be mixed and then fixed. In this state, the upper end of small diamond grains 4 is projected over nickel plating 2. Thereby foreign substances aggregated in the concave of the abrasive cloth are effectively removed and at the same time wearing the surface of the nickel plating 2 is prevented. Achieved are the stabilization of a polishing speed in polishing and the inhibition of dropping out diamond grains and wearing nickel plating in dressing.
Claims18
A polishing system comprising:
- an abrasive cloth;
- and
- a dressing tool for dressing the abrasive cloth;
- wherein the dressing tool includes a substrate, diamond grains disposed on said substrate, and particles disposed on said substrate around said diamond grains and having an average particle diameter smaller than an average diameter of said diamond grains.
A dressing tool for dressing a surface of an abrasive cloth, said dressing tool comprising:
- a substrate;
- diamond grains disposed on said substrate;
- and
- particles, disposed on said substrate around said diamond grains, said particles having an average particle diameter smaller than an average diameter of said diamond grains,
- wherein said particles are made of diamond.
A process for preparing a dressing tool for the surface of an abrasive cloth for use in a mechanochemical polishing process for polishing a semiconductor wafer, comprising the steps of:
- developing a thin metal plating in a mixed state of diamond grains of plural groups each having different average particle diameters to fix temporarily said diamond grains onto a substrate;
- removing floated diamond grains which are not in contact with said substrate;
- and
- metal plating to form a predetermined thickness of metal plating.
A process for preparing a dressing tool for the surface of an abrasive cloth for use in a mechanochemical polishing process for polishing a semiconductor wafer, comprising the steps of:
- developing a thin metal plating in a mixed state of diamond grains and other particles smaller than said diamond grains to fix temporarily said diamond grains and said other particles onto a substrate;
- removing floating diamond grains which are not in contact with said substrate;
- and
- metal plating to form a predetermined thickness of metal plating.
A process for preparing a dressing tool for the surface of an abrasive cloth for use in a mechanochemical polishing process for polishing a semiconductor wafer, comprising the steps of:
- opening holes through an insulator plate;
- adhering said plate to a substrate;
- and
- metal plating selectively on said substrate inside said holes through said plate to fix diamond grains to the substrate only inside said holes, said plate is kept adhered to the substrate.
A process for preparing a dressing tool for the surface of an abrasive cloth for use in a mechanochemical polishing process for polishing a semiconductor wafer, comprising the steps of:
- fixing diamond grains on a substrate by nickel plating;
- and
- forming a protective layer on the resultant nickel plating.
A dressing tool for the surface of an abrasive cloth for use in a mechanochemical polishing process for polishing a semiconductor wafer comprising diamond grains, metal plating and a protective layer covering the metal plating.
A dressing tool for dressing a surface of an abrasive cloth, said dressing tool comprising:
- diamond grains of an average particle diameter large enough to exhibit dressing work;
- and
- a plate thinner than said diamond grains,
- wherein said diamond grains are contained within said plate.
Dependencies are inferred from the claim text.