Chemical-mechanical polishing device

A chemical-mechanical polishing device comprising:

• a conditioner, wherein the conditioner comprises a lower surface and an upper surface which are parallel to each other, and further comprises a plurality of cavities distributed throughout the conditioner, wherein the cavities penetrate through the conditioner and connect the upper surface with the lower surface, wherein the upper surface has a plurality of first circular trenches and a plurality of second trenches distributed between the cavities and the first type trenches;
• and
• a plurality of diamond granules, mounted on the outer rim of the lower surface on the conditioner, wherein
• de-ionized water transfused into the first trenches flows along the second trenches and the cavities to a space around the diamond granules.

A chemical-mechanical polishing (CMP) device, comprising:

• a polishing table spinning in a fixed direction during a CMP process is performed, wherein the polishing table includes a polishing pad;
• a conditioner, wherein the conditioner comprises:
• a lower surface facing the polishing pad, wherein a plurality of diamond granules are mounted on a rim of the lower surface and a plurality of cavities are located between the diamond granules at the rim of the lower surface;
• and
• an upper surface coupled with a moveable holder and having a plurality of first circular trenches located thereon, wherein the cavities on the lower surface of the conditioner penetrate through the conditioner to connect the upper surface with the lower surface.