Method and apparatus for conditioning a polishing pad

An apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers, the apparatus comprising:

• an elongated pad conditioning member rotatably positioned around a shaft, the shaft having an axis substantially parallel to a plane of the polishing pad and wherein the elongated pad conditioning member is positioned at a non-perpendicular angle with respect to a direction of travel of the polishing pad;
• an abrasive substance disposed along at least a portion of an exterior circumference of the elongated pad conditioning member;
• a pressure application system connected to the shaft and configured to removably press the elongated pad conditioning member against the polishing pad;
• and
• a motor connected to the elongated pad conditioning member and configured to continuously rotate the exterior circumference of the elongated pad conditioning member at varying speeds about the shaft while the pressure application system presses the elongated pad conditioning member against the polishing pad.

A method for conditioning a polishing pad on a linear wafer polisher used in chemical mechanical planarization of semiconductor wafers, the method comprising steps of:

• providing a polishing pad conditioner comprising a cylindrical roller having a longitudinal rotational axis and an abrasive substance affixed along at least a portion of an outer circumference of the roller;
• positioning the polishing pad conditioner adjacent the polishing pad, wherein the longitudinal rotational axis of the cylindrical roller is oriented substantially parallel to the polishing pad and at a non perpendicular angle with respect to a direction of travel of the polishing pad;
• continuously rotating at a variable speed the cylindrical roller against the polishing pad while the polishing pad is moving;
• and
• maintaining a pressure against the polishing pad with the cylindrical roller.

A method of conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers comprising the steps of:

• providing a polishing pad conditioner comprising a roller having an abrasive substance longitudinally affixed along a predetermined portion of an outer circumference of the roller, the roller positioned adjacent the polishing pad so as not to be at a right angle with a direction of travel of the polishing pad;
• orienting the roller such that the abrasive substance faces the polishing pad;
• moving the roller against the polishing pad while the polishing pad is moving;
• variably rotationally reciprocating the roller a predetermined rotational distance about a rotational axis of the roller;
• and,
• maintaining a predetermined pressure between the roller and the polishing pad while the pad is moving and the roller is reciprocating, whereby the abrasive substance removes excess slurry and debris from the polishing pad.