Wafer notch polishing machine and method of polishing an orientation notch in a wafer
AssigneeTSK America, Inc.
InventorsRobert E. Steere, Jr., Robert E. Steere, III
Life of this patent
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Abstract
The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.
Claims23
A wafer notch polishing machine comprising
- a chuck for holding a wafer having a peripheral notch thereon;
- means for moving said chuck in two mutually perpendicular directions in a common plane;
- a polishing unit for moving a polishing medium within the notch along an axis perpendicular to said common plane and angularly within a plane perpendicular to said common plane.
A machine comprising
- at least one block having a nose surface for receiving a polishing medium thereon for polishing an edge of a workpiece;
- means for pivoting said block about a plane of the workpiece between a first position with said block disposed angularly of said plane on one side of the workpiece and a second position with said block disposed angularly of said plane on an opposite side of the workpiece;
- and
- means for oscillating said block longitudinally thereof during pivoting of said block between said positions.
method of polishing an orientation notch in a wafer, said method comprising the steps of
- holding a wafer having a peripheral notch therein on a fixed plane;
- moving the wafer in two mutually perpendicular directions in said plane;
- moving a polishing medium within the notch along an axis perpendicular to said fixed plane and angularly within a plane perpendicular to said fixed plane during movement of the wafer in said fixed plane.
Dependencies are inferred from the claim text.