Apparatus and method for soldering through-hole components on circuit board
AssigneeASUSTeK COMPUTER INC.
InventorsShui-Town Lin, Shih-Ren Chuang
Life of this patent
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Abstract
A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, the opening defining an opening wall surface, providing a slit at a predetermined position of the opening wall surface; and (2) blowing a gas of a predetermined temperature and a predetermined pressure at a predetermined time to the position of the solder bridges through the slit for removing the solder bridges from the through-hole component.
Claims10
An apparatus for soldering a through-hole component with pins protruding therefrom inside a through-hole through a printed circuit board, said apparatus comprising:
- a solder tank containing molten solder therein;
- a fixture disposed over said solder tank, said fixture having a tubular opening with an inner wall, said printed circuit board being placed on said fixture such that said through-hole is over said opening;
- and
- means for causing a gas of a predetermined temperature and a predetermined pressure to be blown into said opening and thereby removing portions of said solder remaining between pairs of said pins.
Dependencies are inferred from the claim text.