Wire bonding method and apparatus
AssigneeKabushiki Kaisha Shinkawa
InventorsToru Mochida, Shinichi Nishiura
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Abstract
So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.
Claims2
A wire bonding apparatus comprising a Z-axis motor for raising and lowering a bonding tool through which a wire is passed, and a motor controller which outputs commands that drive said Z-axis motor, so that a first bonding point and a second bonding point on a semiconductor chip are connected by a wire, said apparatus further comprising of:
- a bonding position detection sensor which inputs positions of bonding points,
- a memory which stores a plurality of bonding positions and looping parameters, said looping parameters comprising a raising amount for each of said plurality of bonding positions and a sinking in amount for each of said plurality of bonding positions,
- a Z-position operational processor which calculates an amount of raising of said bonding tool based upon a bonding position used as a reference among a plurality of bonding positions stored in said memory, and said looping parameters, and
- a main controller which controls said Z-axis motor controller based upon an amount of raising of said bonding tool supplied from said Z-position operational processor whereby a wire loop of a same height and shape is obtained at each of said plurality of bonding positions.
Dependencies are inferred from the claim text.