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US 6,305,258 B1Granted
Punch actuator monitoring system and method
AssigneeInternational Business Machines Corporation
InventorsDonald W. Henderson, Edward F. Helinski
Life of this patent
Estimating the term…
Abstract
A method and apparatus for detecting performance of an apparatus for punching holes in a substrate, ensuring hole quality and/or minimizing or eliminating damage to the films during the hole punching process.
Claims15
A method for improving quality of a substrate processed by punch assemblies, each punch assembly comprising a punch and a punch actuator for punching holes in a substrate, the method comprising:
- connecting accelerometers to said punch assemblies;
- sensing operational characteristics of said punch assemblies with said accelerometers;
- and
- detecting a degraded performance of at least one of said punch assemblies based on said sensed operational characteristics.
1 more element
An apparatus for mechanically forming holes in a substrate, comprising:
- a plurality of punch assemblies each comprising a punch for engaging the substrate and forming holes in the substrate and a punch actuator for actuating the punches;
- and
- means for sensing operational characteristics of the punch assemblies comprising accelerometers connected to the punch assemblies.
Dependencies are inferred from the claim text.