Motor vehicle transmission shifting device with a curved printed circuit board and process for manufacturing the printed circuit board
AssigneeLemforder Metallwaren AG
InventorsMetin Ersoy, Hans-Joseph Gassmann
Life of this patent
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Abstract
A shifting device for the transmission of a motor vehicle with a curved printed circuit board inserted under the curved cover and to a process for preparing this curved printed circuit board with the components inserted. The shifting movements performed at the gearshift lever of the shifting device are electronically transmitted to the transmission. The components are inserted according to the present invention on a rigid printed circuit board in the flat state and the printed circuit board is soldered in the curved state, wherein the printed circuit board, consisting of glass fiber-reinforced epoxy resin, remains in this curved state after cooling due to its inner structure.
Claims24
A process for manufacturing a curved printed circuit board, comprising the steps of:
- applying solder to a rigid, thermoplastically deformable printed circuit board, provided with conductor strips, in a flat state;
- subsequently positioning components on the printed circuit board;
- clamping the printed circuit board with the components inserted in a frame in a curved state to impart a predetermined curvature to said printed circuit board whereby the printed circuit board conforms to the shape of the frame;
- heating the clamped circuit board to a soldering temperature in a soldering furnace, and
- cooling the printed circuit board to its solidification point.
A process for manufacturing a curved printed circuit board, the process comprising the steps of:
- providing a thermoplastically deformable printed circuit board in a flat state, said printed circuit board having a solidification point;
- applying solder to said printed circuit board in said flat state;
- positioning components on said solder on said printed circuit board in said flat state;
- clamping said printed circuit board with said components inserted in a frame into a curved state to impart a predetermined curvature to said printed circuit board whereby the printed circuit board conforms to the shape of the frame;
- heating said clamped printed circuit board to a soldering temperature;
- cooling said clamped printed circuit board to said solidification point.
A manufacturing process comprising the steps of:
- providing a thermoplastically deformable printed circuit board in a flat state, the printed circuit board being provided with conductor strips;
- applying solder to the rigid thermoplastically deformable printed circuit board in the flat state;
- positioning components on the printed circuit board;
- providing a frame having a curved surface providing a predetermined curvature;
- clamping the printed circuit board, with the components inserted, to the frame to impart the predetermined curvature to said printed circuit board whereby the printed circuit board conforms to the shape of the frame;
- heating the clamped circuit board to a soldering temperature in a soldering furnace to thermoplastically deform said printed circuit board;
- and
- cooling the printed circuit board to its solidification point whereby said printed circuit board maintains said predetermined curvature.
A manufacturing process comprising the steps of:
- providing a thermoplastically deformable printed circuit board in a flat state, the printed circuit board being provided with conductor strips;
- applying solder to the rigid thermoplastically deformable printed circuit board in the flat state;
- positioning components on the printed circuit board;
- providing a frame having a curved surface providing a predetermined curvature;
- clamping the printed circuit board, with the components inserted, to the frame by which said printed circuit board is statically molded to impart the predetermined curvature to said printed circuit board;
- heating the clamped circuit board to a soldering temperature in a soldering furnace to thermoplastically deform said printed circuit board;
- and
- cooling the printed circuit board to its solidification point whereby said printed circuit board maintains said predetermined curvature.
Dependencies are inferred from the claim text.