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US 6,305,067 B1Granted
Elastic plate structure for preventing electromagnetic interference and manufacturing method for the same
OwnerChin Fu Hornginventor
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Abstract
A manufacturing method of elastic plate structure for preventing electromagnetic interference comprises step of: preparing a Be—Cu plate and performing thermal treatment to the Be—Cu plate; electroplating the Be—Cu plate; punching and processing the Be—Cu plate to form elastic plate structure for preventing EMI. The above-manufactured Be—Cu plate has the advantages of excellent conductivity, flexibility, low resistance and non-oxidation, thus providing added-value to product using the elastic plate structure.
Claims3
A manufacturing method of an elastic plate structure for preventing electromagnetic interference comprising the steps of:
- (a) providing a beryllium-copper plate;
- (b) thermally-treating said beryllium-copper plate to provide high stiffness thereto;
- (c) electroplating said thermally-treated beryllium-copper plate;
- (d) punching and forming said electroplated beryllium-copper plate into a serpentine contour to form an elastic plate;
- and,
- (e) mounting a plurality of said elastic plates to a circuit board adjacent an area of a microprocessor and memory for contact with a housing thereof.
3 more elements
Dependencies are inferred from the claim text.