Self-dispersing curable epoxy resins, dispersions made therewith, and coating compositions made therefrom
AssigneeHenkel Corporation
InventorsJohn G. Papalos, Shailesh Shah, Reuben H. Grinstein, Joseph L. Mulvey, Brian G. Jewell
Life of this patent
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Abstract
A self-dispersing curable epoxy composition is prepared upon contacting an epoxy resin with a polyoxyalkylenemonoamine having a molecular weight of from about 3,000 to about 15,000 in a ratio of about 0.001 to 0.060 reactive equivalents of polyoxyalkylenemonoamine to about 1.0 reactive equivalents of epoxy resin. The self-dispersing curable epoxy resin forms an aqueous dispersion upon mixing with water. When cured, the dispersion is useful as a coating composition.
Claims13
A self-dispersing curable epoxy resin composition comprising the addition product of reactants comprising an epoxy resin, a polyhydric phenol, and a polyoxyalkylenemonoamine having a number average molecular weight of from about 3,000 to about 15,000 in a ratio of about 0.001 to 0.060 reactive equivalents of polyoxyalkylenemonoamine to about 1.0 reactive equivalents of epoxy resin.
An aqueous dispersion comprising a self-dispersing epoxy resin, wherein the self-dispersing epoxy resin is prepared by the steps comprising:
- (a) preparing an advanced epoxy resin by contacting a polyepoxide and a polyhydric phenol, where the ratio of the reactive equivalents of the polyepoxide to the polyhydric phenol is in the range from about 1:0.25 to 1:0.75, and
- (b) contacting the advanced epoxy resin with a polyoxyalkylenemonoamine having a number average molecular weight of from about 3,000 to about 15,000, wherein the ratio of the reactive equivalents of the polyoxyalkylenemonoamine to the reactive equivalents of the polyepoxide is in the range from about 0.001:1 to about 0.060:1.
A method of making a self-dispersing aqueous epoxy resin composition comprising preparing an epoxy resin by contacting a polyepoxide and a polyhydric phenol, where the ratio of the reactive equivalents of the polyepoxide to the polyhydric phenol is in the range from about 1:0.25 to 1:0.75 and reacting said epoxy resin with a polyoxyalkylenemonoamine having a number average molecular weight of from about 3,000 to about 15,000 in a ratio of about 0.001 to 0.060 reactive equivalents of polyoxyalkylenemonoamine to about 1.0 reactive equivalents of epoxy resin.
Dependencies are inferred from the claim text.