Wafer polishing apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorsTakao Inaba, Minoru Numoto, Kenji Sakai, Manabu Satoh
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Abstract
Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.
Claims1
A wafer polishing apparatus which presses a wafer against a rotating polishing pad to polish the surface of said wafer, said wafer polishing apparatus comprising:
- stock removal detecting means for detecting a stock removal of said wafer;
- storage means for containing a model stock removal of said wafer in accordance with a polishing time;
- control means for comparing the stock removal detected by said stock removal detecting means and the model stock removal stored in said storage means, determining timings for dressing and replacing said polishing pad in accordance with a difference between said stock removals, and outputting determination results;
- and
- display means for showing said determination results output from said control means.
Dependencies are inferred from the claim text.