# US 6,297,562 B1 · Semiconductive chip having a bond pad located on an active device

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- Number: US 6,297,562 B1
- Document ID: US6297562B1
- Status: Granted
- Kind: B1
- Application number: 09/399,363
- Filed: 1999-09-20
- Granted: 2001-10-02
- Earliest claimed: 1999-09-20
- Assignees: Telefonaktieboalget LM Ericsson (publ)
- Inventors: Lars Tilly
- Web page: https://patentgrep.com/patent/US6297562B1

## CPC

- H10W 72/072: {of bump connectors}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/90: Bond pads, in general
- H10W 72/01215: {forming coatings}
- H10W 72/01225: {in solid form, e.g. by using a powder or by stud bumping}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/251: {Materials}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/934: {Cross-sectional shape, i.e. in side view}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductive chip having at least one active device, and at least one bond pad located on said active device. The bond pad has at least one deformable member, and the deformable member is deformable when conductive stud is bonded to said bond pad so as to prevent damage to the active device during the bonding of the conductive stud to the bond pad, such as by an ultrasonic bonding technique. A plurality of the deformable members may define a pattern on the bond pad that deforms when the conductive stud is bonded to the bond pad.

## Claims

### Claim 1

A semiconductive chip comprising:
at least one active device; and
at least one bond pad located on said active device, said bond pad having a patterned portion that is deformable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said deformable member comprises a plurality of deformable members, said plurality of deformable members defining a pattern.

### Claim 2 (depends on 1)

The semiconductive chip of claim 1, wherein said pattern is an etched pattern.

### Claim 3 (depends on 1)

The semiconductive chip of claim 1, wherein said bond pattern is symmetrical about a line extending across a midpoint of said bond pad.

### Claim 4 (depends on 1)

The semiconductive chip of claim 1, further comprising a conductive stud bonded by an ultrasonic bond to said bond pad so as to deform said deformable member.

### Claim 5 (depends on 1)

The semiconductive chip of claim 1, wherein said active device includes at least one transistor.

### Claim 6 (depends on 4)

The semiconductive chip of claim 4, in combination with a substrate, said conductive stud being bonded to said substrate.

### Claim 7 (depends on 6)

The semiconductive chip of claim 6, further comprising a heat conductive material located between said semiconductive chip and said substrate.

### Claim 8 (depends on 7)

The semiconductive chip of claim 7, further comprising a dielectric film coating said conductive stud, said heat conductive material being an electrically conductive material.

### Claim 9 (depends on 7)

The semiconductive chip of claim 7, wherein said heat conductive material is a dielectric material.

### Claim 10 (depends on 1)

The semiconductive chip of claim 1, wherein the deformable member includes a most distal surface raised from an intermediate surface of the bond pad.

### Claim 11

A semiconductive chip comprising:
at least one active device; and
at least one bond pad located on said active device, said bond pad having a patterned portion that is deformiable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said deformable member is one of a plurality of deformable members, said deformable members each protruding from a common surface of said bond pad a same distance.

### Claim 12

A semiconductive chip comprising:
at least one active device; and
at least one bond pad located on said active device, said bond pad having a patterned portion that is deformable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said patterned portion includes a plurality of deformable members each protruding from a surface of said bond pad and being spaced from each other by a gap.

### Claim 13

A semiconductive chip comprising.
at least one active device; and
at least one bond pad located on said active device, said bond pad having a patterned portion that is deformable when a conductive stud is bonded to said bond pad so as to prevent damage to said active device during the bonding of said conductive stud to said bond pad, wherein said patterned portion includes a criss-cross pattern defined by a plurality of deformable members.

### Claim 14 (depends on 12)

The semiconductive chip of claim 12, further comprising the conductive stud, said conductive stud being a gold stud bonded to said bond pad by an ultrasonic bond.

### Claim 15 (depends on 13)

The semiconductive chip of claim 13, further comprising the conductive stud, said conductive stud being a gold stud bonded to said bond pad by an ultrasonic bond.