# US 6,297,469 B1 · Process for producing a metal-ceramic substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,297,469 B1 - Document ID: US6297469B1 - Status: Granted - Kind: B1 - Application number: 09/330,999 - Filed: 1999-06-14 - Granted: 2001-10-02 - Earliest claimed: 1998-06-19 - Inventors: Jurgen Schulz-Harder - Web page: https://patentgrep.com/patent/US6297469B1 ## CPC - H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)} - H05K 3/0029: {of inorganic insulating material} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The invention relates to a novel process for producing a metal-ceramic substrate in which at least one surface side of the ceramic layer is provided with at least one first structured metal layer and at least one second metal layer is applied to the first by electroless chemical deposition, and in which at least one depression or hole, or a plurality of depressions or holes are formed in the ceramic layer by laser machining to form a scored line. ## Claims ### Claim 1 A process for producing a metal-ceramic substrate, in which at least one surface side of a ceramic layer is provided with at least one first structured metal layer and at least one second metal layer applied to the first structured metal layer by electroless chemical deposition, and in which at least one depression or hole, or a plurality of depressions or holes are formed in the ceramic layer by laser machining to form a scored line, wherein the laser machining is done after the first structured metal layer is produced in an atmosphere containing at least 30% by volume oxygen. ### Claim 2 (depends on 1) The process as claimed in claim 1, wherein first and second surface sides of the ceramic layer are provided each with the first structured metal layer and the at least one second metal layer is deposited with electroless chemical deposition on the at least one first metal layer. ### Claim 3 (depends on 1) The process as claimed in claim 1, wherein laser machining is done on both surface sides of the ceramic layer. ### Claim 4 (depends on 1) The process as claimed in claim 1, wherein the first metal layer is structured by an etching and masking technique. ### Claim 5 (depends on 1) The process as claimed in claim 1, wherein the first metal layer is applied in the form of a metal foil by means of a direct bonding process. ### Claim 6 (depends on 1) The process as claimed in claim 1, wherein the first metal layer is applied in the form of a metal foil using an active soldering process. ### Claim 7 (depends on 1) The process as claimed in claim 1, wherein the first metal layer is applied using a thick film technique. ### Claim 8 (depends on 1) The process as claimed in claim 1, wherein the first metal layer consists of copper or a copper alloy. ### Claim 9 (depends on 1) The process as claimed in claim 1, wherein the first metal layer is applied with a thickness of 200-500 microns. ### Claim 10 (depends on 1) The process as claimed in claim 1, wherein the ceramic layer is selected from the group consisting of Al2O3, AlN, Si3N4, and SiC. ### Claim 11 (depends on 1) The process as claimed in claim 1, wherein a laser with a wavelength of approximately 10 microns is used for laser treatment. ### Claim 12 (depends on 1) The process as claimed in claim 1, wherein a laser with a wave length of approximately 1 micron is used for laser treatment. ### Claim 13 (depends on 1) The process as claimed in claim 1, wherein the metal ceramic substrate is chemically or mechanically cleaned after laser machining. ### Claim 14 (depends on 13) The process as claimed in claim 13, wherein the cleaning takes place by alkali treatment or by etching off a thin partial surface layer of the first metal layer. ### Claim 15 (depends on 1) The process as claimed in claim 1, wherein a surface of the first metal layer is activated before chemical deposition of the at least one second metal layer. ### Claim 16 (depends on 1) The process as claimed in claim 1, wherein chemical deposition or metal coating takes place using Ni-phosphorus or Ni-boron with activation by palladium chloride, chemical tin or chemical copper. ### Claim 17 (depends on 1) The process as claimed in claim 1, wherein at least one more metal layer is produced on at least a part of the second metal layer by electroless chemical deposition. ### Claim 18 (depends on 17) The process as claimed in claim 17, wherein the at least one additional metal layer or the at least one second metal layer is gold or palladium and is applied by chemical deposition. ### Claim 19 (depends on 1) The process as claimed in claim 1, wherein laser treatment takes place in an oxygen-enriched air or gas flow. ### Claim 20 (depends on 1) The process as claimed in claim 1, wherein laser treatment takes place in a stream of oxygen. ### Claim 21 (depends on 1) The process as claimed in claim 1, wherein laser treatment takes place through a nozzle, from which, in addition to a laser beam, an air or gas stream also emerges. ### Claim 22 (depends on 21) The process as claimed in claim 21, wherein a distance between the nozzle and the metal-ceramic substrate in laser machining is less than or equal to 5 mm. ### Claim 23 (depends on 21) The process as claimed in claim 21, wherein the nozzle is exposed to a gas pressure of at least 50 kPa.