# US 6,297,174 B2 · Method for the formation of a planarizing coating film on substrate surface

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- Number: US 6,297,174 B2
- Document ID: US6297174B2
- Status: Granted
- Kind: B2
- Application number: 09/765,276
- Filed: 2001-01-22
- Published: 2001-06-07
- Granted: 2001-10-02
- Earliest claimed: 1998-06-24
- Assignees: Tokyo Ohka Kogyo Co., Ltd.
- Inventors: Etsuko Iguchi; Takako Hirosaki; Masakazu Kobayashi
- Web page: https://patentgrep.com/patent/US6297174B2

## CPC

- H10P 14/683: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC}
- H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
- H10P 95/064: {the removal being chemical etching}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method is disclosed for the formation of a planarizing coating film on the surface of a substrate having a stepped level difference under processing for the manufacture of semiconductor devices. The inventive method capable of giving a planarizing coating film of excellent planarity and good adhesion to the substrate surface comprises the steps of: (a) coating the substrate surface with a coating solution containing, as a film-forming solute uniformly dissolved in an ,organic solvent, a nitrogen-containing organic compound such as benzoguanamine and melamine having, in a molecule, at least two amino and/or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer; (b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and (c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250° C.

## Claims

### Claim 1

A method for the formation of a planarizing coating film on a substrate surface which comprises the steps of:
(a) coating the substrate surface with a coating solution consisting of an organic solvent and, as a film-forming solute uniformly dissolved in the organic solvent, a nitrogen-containing organic compound selected from the group consisting of melamine, benzoguanamine, acetoguanamine, glycoluril, urea, thiourea, guanidine, dicyandiamide, alkylene ureas and succinamide having, in a molecule, at least two amino or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer;
(b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and
(c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250° C.

### Claim 2 (depends on 1)

The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the alkyl group of the hydroxyalkyl group and alkoxyalkyl group substituting the nitrogen-containing organic compound has 1 to 4 carbon atoms.

### Claim 3 (depends on 1)

The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the alkoxy group of the alkoxyalkyl group substituting the nitrogen-containing organic compound has 1 to 4 carbon atoms.

### Claim 4 (depends on 1)

The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the film-forming solute in the coating solution is a methoxymethylated benzoguanamine or a methoxymethylated melamine.

### Claim 5 (depends on 1)

The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the organic solvent of the coating solution is selected from the group consisting of alkyleneglycol monoalkyl ethers and esters thereof.

### Claim 6 (depends on 1)

The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the baking treatment in step (c) is conducted for a length of time in the range from 1 to 30 minutes.