NROM fabrication method
AssigneeSaifun Semiconductors Ltd.
InventorEitan Boaz
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AssigneeSaifun Semiconductors Ltd.
InventorEitan Boaz
Estimating the term…
A method of fabricating an oxide-nitride-oxide (ONO) layer in a memory cell to retain charge well in the nitride layer includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer and oxidizing a top oxide layer thereby causing oxygen to be introduced into the nitride layer. Another method includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer and oxidizing a portion of a top oxide layer, thereby causing oxygen to be introduced into the nitride layer and depositing a remaining portion of the top oxide layer, thereby assisting in controlling the amount of oxygen introduced into the nitride layer. A further method includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer, depositing a portion of a top oxide layer and oxidizing a remaining portion of the top oxide layer, thereby causing oxygen to be introduced into the nitride layer.
A method of fabricating an oxide-nitride-oxide (ONO) layer in a memory cell, the method comprising the steps of:
A method of fabricating an oxide-nitride-oxide (ONO) layer in a memory cell, the method comprising the steps of:
A method for fabricating an oxygen-nitride-oxygen (ONO) layer in a memory cell, and for controlling the thickness of a nitride layer and introducing oxygen thereto, the method comprising the steps of:
Dependencies are inferred from the claim text.