Chemical delivery system having purge system utilizing multiple purge techniques
AssigneeAdvanced Technology Materials, Inc.
InventorsJohn N. Gregg, Craig M. Noah, Robert M. Jackson
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AssigneeAdvanced Technology Materials, Inc.
InventorsJohn N. Gregg, Craig M. Noah, Robert M. Jackson
Estimating the term…
A chemical delivery system which utilizes multiple techniques to achieve a suitable chemical purge of the chemical delivery system is provided. A purge sequence serves to purge the manifold and canister connection lines of the chemical delivery system prior to removal of an empty chemical supply canister or after a new canister is installed. More particularly, a purge technique which may utilizes a variety of combinations of a medium level vacuum source, a hard vacuum source, and/or a liquid flush system is disclosed. By utilizing a plurality of purge techniques, chemicals such as TaEth, TDEAT, BST, etc. which pose purging difficulties may be efficiently purged from the chemical delivery system. The chemical delivery system may also be provided with an efficient and conveniently located heater system for heating the chemical delivery system cabinet.
A method of forming a layer upon a semiconductor substrate, comprising:
Dependencies are inferred from the claim text.