# US 6,295,307 B1 · Laser diode assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,295,307 B1 - Document ID: US6295307B1 - Status: Granted - Kind: B1 - Application number: 09/170,491 - Filed: 1998-10-13 - Granted: 2001-09-25 - Earliest claimed: 1997-10-14 - Assignees: Decade Products, Inc. - Inventors: Brian P. Hoden; Jon B. Jacob - Web page: https://patentgrep.com/patent/US6295307B1 ## CPC - H01S 5/02365: by clamping - H01S 5/0237: by soldering - H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements} - H01S 5/4018: {Lasers electrically in series} - H01S 5/4043: {with vertically stacked active layers} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract A method and apparatus for laser diode bar assembly. A stacked array embodiment provides for efficient cooling of the diode bars and electrical connection between diode bars while maximizing alignment of the diode bars. The spacers are connected to a conductive surface on a heat spreader. In the stacked array, one or more diode bars are alternated in series with two or more conductive spacers, with a series circuit provided from diode bar to diode bar. The spacers hold the diodes spaced apart from insulating grooves in the conductive layer on the substrate. Alternatively, thermally conductive separator fins extend from the heat spreader substrate to contact the diode bars situated between the spacers to promote rapid heat transfer from the diodes while maintaining the diode bars electrically isolated from the conductive layer on the substrate. An apparatus and method are provided for assembling the stacked array assembly. A jig apparatus incorporates a tilted working surface upon which the diode bar/spacers subassembly is placed. Planar vertical walls extend up from the tilted working surface. The tilt to the working surface provides a gravity assist to the proper alignment of the diode bars and spacers against the vertical walls. A clamp squeezes the diode bars and spacers together and against one of the walls to foster optimized alignment and parallelism of the diode bars. A wedged array embodiment of the invention employs a specially grooved substrate. The diode bars are placed in the grooves, and customized wedges are then pressed into the grooves with the diodes therein, the wedges acting to push the diodes into proper parallel alignment in the grooves. Means for providing both series and parallel electrical circuits between diode bars are provided. ## Claims ### Claim 1 A laser diode assembly comprising: a base substrate comprising a major surface having at least one groove therein, said at least one groove defined by a first wall and a second wall, said walls being nonparallel and said first wall being perpendicular to said major surface; a diode bar within said at least one groove; and a conductive wedge in electrical contact with said diode bar and forcibly inserted into said groove between said diode bar and said second wall, thereby to press said diode bar against said first wall. ### Claim 2 (depends on 1) An assembly according to claim 1 comprising a plurality of diode bars disposed within corresponding ones of a plurality of grooves, each groove defined by a first wall and a second wall, said first wall and said second wall being nonparallel and said first wall being perpendicular to said major surface. ### Claim 3 (depends on 2) An assembly according to claim 2 wherein said second wall is inclined in relation to said major surface and intersects said bottom at an angle. ### Claim 4 (depends on 3) An assembly according to claim 3 wherein said wedge comprises a first face and a second face intersecting at an angle substantially complementary to said angle of said second wall. ### Claim 5 (depends on 2) An assembly according to claim 2 wherein said first wall and said second wall converge toward a bottom of each groove. ### Claim 6 (depends on 5) An assembly according to claim 5 wherein said rows are parallel rectilinear. ### Claim 7 (depends on 5) An assembly according to claim 5 wherein said rows are parallel curved. ### Claim 8 (depends on 5) An assembly according to claim 5 further comprising means for providing series electrical contact between a first diode bar in a first groove and a second diode bar in an adjacent second groove. ### Claim 9 (depends on 8) An assembly according to claim 8 wherein said means for providing series electrical contact comprises a conductive coating upon said first walls of said grooves and a major surface of said substrate. ### Claim 10 (depends on 9) An assembly according to claim 9 wherein said means for providing series electrical contact further comprises a conductive coating upon said diode bars. ### Claim 11 (depends on 8) An assembly according to claim 8 wherein said means for providing series contact comprises a first conductive strip extending between said first diode bar and said wedge in said second groove. ### Claim 12 (depends on 11) An assembly according to claim 11 further comprising a second conductive strip disposed between said wedge and second wall of said second groove. ### Claim 13 (depends on 12) An assembly according to claim 12 further comprising a third conductive strip between said wedge and said diode bar in said second groove. ### Claim 14 (depends on 13) An assembly according to claim 13 wherein said three conductive strips are integrated into a single conductive strip insertable into said adjacent grooves. ### Claim 15 (depends on 5) An assembly according to claim 5 further comprising means for providing parallel electrical contact between a first diode bar in a first groove and a second diode bar in an adjacent second groove, wherein said base substrate defines a plurality of apertures therethrough, and said parallel contact means comprising a conductor bar comprising: a first conductive member insertable through an aperture in said base substrate for electrical contact with said wedge in said first groove; a second conductive member insertable through another aperture in said base substrate for electrical contact with said second diode in said second groove; and a conductive bridge member connecting said two conductive members. ### Claim 16 A laser diode assembly comprising: a planar, electrically non-conductive, heat spreader substrate having a first face and a second face; at least one electrically conductive layer disposed upon said first face of said substrate; at least two adjacent electrically and thermally conductive spacers physically and electrically connected to said conductive layer, each of said conductive spacers in spaced relation from adjacent ones of said spacers to define a gap between each two adjacent said spacers; and at least one laser diode bar disposed in said gap between adjacent said spacers, held by and in electrical contact with both said at least two adjacent spacers, wherein thermal energy flows into both of said at least two adjacent spacers from said at least one laser diode bar. ### Claim 17 (depends on 16) A laser diode assembly according to claim 16, further comprising at least one groove defined in said substrate and completely penetrating said conductive layer, wherein adjacent conductive spacers are connected to said conductive layer on opposite sides of said groove thereby to hold said diode bar to and spaced apart from said groove. ### Claim 18 (depends on 17) A laser diode assembly according to claim 17 wherein each of said conductive spacers is parallel to adjacent ones of said spacers, and further comprising a coolant manifold bonded to said second face of said substrate. ### Claim 19 (depends on 16) A laser diode assembly according to claim 16 wherein said substrate further comprises at least one separator fin extending from said first face and into each said gap between adjacent spacers. ### Claim 20 (depends on 19) A laser diode assembly according to claim 19 wherein said at least one diode bar physically contacts said at least one separator fin. ### Claim 21 (depends on 19) A laser diode assembly according to claim 19 wherein said at least one separator fin is perpendicular to said first face. ### Claim 22 (depends on 20) A laser diode assembly according to claim 20 wherein said conductive layer is disposed upon perpendicular sides of said at least one separator fin. ### Claim 23 (depends on 22) A laser diode assembly according to claim 22 wherein said at least two spacers electrically contact said conductive layer disposed upon said perpendicular sides, and said at least one diode bar physically contacts said at least one separator fin.