Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer

A microelectronic assembly comprising:

• a microelectronic element having a front face including contacts and a back surface remote therefrom;
• a mass of a dielectric material at least partially encapsulating said microelectronic element so that said encapsulated microelectronic element forms a body having exterior surfaces;
• wherein said back surface of said microelectronic element is exposed at an exterior surface of said body;
• conductive units secured to said mass of dielectric material;
• said units including bottom flange portions overlying a surface of the body and posts extending from said flange portions into said body, said bottom flange portions having larger cross-sectional dimensions than said posts;
• wherein said conductive units further include top flange portions remote from said bottom flange portions, said top flange portions having larger cross-sectional dimensions than said posts;
• and
• conductive elements extending through said mass of dielectric material and electrically interconnecting said contacts with said conductive units.