# US 6,294,826 B1 · Molded electronic component having pre-plated lead terminals and manufacturing process thereof

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- Number: US 6,294,826 B1
- Document ID: US6294826B1
- Status: Granted
- Kind: B1
- Application number: 09/639,821
- Filed: 2000-08-17
- Granted: 2001-09-25
- Earliest claimed: 1996-07-26
- Assignees: NEC Corporation
- Inventors: Yoshio Ida; Akiyoshi Tainaka
- Web page: https://patentgrep.com/patent/US6294826B1

## CPC

- H01G 9/012: specially adapted for solid capacitors
- C25D 5/18: Electroplating using modulated, pulsed or reversing current
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor.

## Claims

### Claim 1

A molded electronic component comprising: an electronic element having an electrode; a pre-plated lead terminal connected to said electrode; and an insulating member encapsulating said electronic element and leaves a portion of said lead terminals exposed, the encapsulated portions of said pre-plated lead terminals having a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less.

### Claim 2 (depends on 1)

The molded electrolnic component as claimed in claim 1, wherein said electronic component is a solid electnolyte capacitor and said plating layer comprises a solder plating layer.

### Claim 3 (depends on 2)

The molded electronic component as claimed in claim 2, wherein an anode lead terminal is welded to an anode lead of said capacitor and a cathode layer of said capacitor via a conductive adhesive.

### Claim 4 (depends on 3)

The molded electronic component as claimed in claim 3, wherein said plating layer is present only on an upper and a lower surface of said anode and cathode lead terminals.