# US 6,294,271 B1 · Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device

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- Number: US 6,294,271 B1
- Document ID: US6294271B1
- Status: Granted
- Kind: B1
- Application number: 09/499,382
- Filed: 2000-02-07
- Granted: 2001-09-25
- Earliest claimed: 1999-02-12
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Inventors: Kazuaki Sumita; Kimitaka Kumagae; Miyuki Wakao; Toshio Shiobara
- Web page: https://patentgrep.com/patent/US6294271B1

## CPC

- H10W 72/30: Die-attach connectors
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 72/07331: {Connecting techniques}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/354: {comprising polymers}
- H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 428/12528: Semiconductor component
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 μm, and a maximum particle diameter of up to 20 μm is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

## Claims

### Claim 1

A sealing material for flip-chip type semiconductor devices in the form of a liquid epoxy resin composition comprising
(A) a liquid epoxy resin,
(B) an inorganic filler, and
(C) a curing accelerator having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1 to 5 μm, and a maximum particle diameter of up to 20 μm, and represented by the following general formula (1):
wherein R1 and R2 each are hydrogen, methyl, ethyl, hydroxymethyl or phenyl, R3 is methyl, ethyl, phenyl or allyl, and R4 is hydrogen or a group of the following formula (2):

### Claim 2 (depends on 1)

The sealing material of claim 1 wherein said curing accelerator is 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole or 2,4-diamino-6-[2′-ethyl-4′-methylimidazolyl-(1)′]-ethyl-S-triazine.

### Claim 3 (depends on 1, 2)

A flip-chip type semiconductor device sealed with the sealing material of claim 1 or 2.