# US 6,294,125 B1 · Method for changing the dielectric properties of a ceramic matrix composite > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,294,125 B1 - Document ID: US6294125B1 - Status: Granted - Kind: B1 - Application number: 09/220,172 - Filed: 1998-12-23 - Granted: 2001-09-25 - Earliest claimed: 1998-12-23 - Assignees: Dow Corning Corporation - Inventors: Todd Jeffery Bridgewater; Daniel Ralph Petrak; Andrew Szweda - Web page: https://patentgrep.com/patent/US6294125B1 ## CPC - C04B 35/589: obtained from {Si-containing} polymer precursors {or organosilicon monomers} - C04B 35/571: obtained from {Si-containing} polymer precursors {or organosilicon monomers} - C04B 35/80: Fibres, filaments, whiskers, platelets, or the like - C04B 38/00: Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof (treating slag with gases or gas generating material C04B5/06 {; expanded graphite C04B35/536}) - C04B 38/0003: {containing continuous channels, e.g. of the "dead-end" type or obtained by pushing bars in the green ceramic product (B28B takes precedence)} - C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE ## Abstract A method for changing the dielectric properties of a polymer impregnated and pyrolyzed ceramic matrix composite (polymer impregnated and pyrolyzed ceramic matrix composite) is disclosed. The polymer impregnated and pyrolyzed ceramic matrix composite can be used in aircraft and turbine engines. polymer impregnated and pyrolyzed ceramic matrix composite comprises a ceramic matrix, a reinforcing fiber, and at least 1 additive used to change dielectric properties (dielectric constant and loss factor). The additive can be a low dielectric constant material having a dielectric constant in the range of 1 to 7.5. The low dielectric constant material can be an oxide such as silica or aluminosilicate or a non-oxide such as silicon nitride, boron nitride, or silicon carbide. The low dielectric constant material can be incorporated in the ceramic matrix as a filler. The low dielectric constant material may be incorporated in a uniform array of holes fabricated in the polymer impregnated and pyrolyzed ceramic matrix composite. ## Claims ### Claim 1 A method for changing dielectric properties of a polymer impregnated and pyrolyzed matrix composite, wherein the method comprises fabricating a uniform array of holes having a diameter in the range of 0.0254 to 0.254 cm in the polymer impregnated and pyrolyzed ceramic matrix composite, which comprises a reinforcing fiber and a ceramic matrix. ### Claim 2 (depends on 1) The method of claim 1, wherein the holes are filled with an additive used to change the dielectric properties of the polymer impregnated and pyrolyzed ceramic matrix composite. ### Claim 3 (depends on 2) The method of claim 2, wherein the additive is selected from the group consisting of low dielectric constant materials and high dielectric constant materials. ### Claim 4 (depends on 3) The method of claim 3, wherein the additive is a low dielectric constant material having a dielectric constant in the range of about 1 to 7.5. ### Claim 5 (depends on 4) The method of claim 4, wherein the low dielectric constant material is selected from the group consisting of oxide and non-oxide materials. ### Claim 6 (depends on 5) The method of claim 5, wherein the oxide material is selected from the group consisting of silica and aluminosilicates. ### Claim 7 (depends on 5) The method of claim 5, wherein the non-oxide material is selected from the group consisting of silicon nitride, boron nitride, and silicon carbide. ### Claim 8 A method for fabricating a polymer impregnated and pyrolyzed ceramic matrix composite, wherein the method comprises: i) impregnating a reinforcing fiber with a matrix mixture comprising a curable preceramic polymer to form a pre-preg, ii) forming a composite shape from the pre-preg, iii) curing the composite shape, iv) pyrolyzing the composite shape in an inert atmosphere at a temperature of at least 1,000° C. to form a pyrolyzed composite comprising a reinforcing fiber and a ceramic matrix, and v) impregnating the pyrolyzed composite with the curable preceramic polymer, vi) pyrolyzing the pyrolyzed composite and curable preceramic polymer from step vi), vii) repeating steps v) and vi) until open porosity of the composite decreases to 2 to 20 vol % to form a polymer impregnated and pyrolyzed ceramic matrix composite; and viii) fabricating a uniform array of holes having a diameter in the range of 0.0254 to 0.254 cm in the polymer impregnated and pyrolyzed ceramic matrix composite. ### Claim 9 (depends on 8) The method of claim 8, wherein at least one additive used to change dielectric properties of the polymer impregnated and pyrolyzed ceramic matrix composite is incorporated therein. ### Claim 10 (depends on 9) The method of claim 9, wherein the additive is a filler, and it is incorporated in the polymer impregnated and pyrolyzed ceramic matrix composite by adding the filler to the matrix mixture before the reinforcing fibers are impregnated with the matrix mixture. ### Claim 11 (depends on 9) The method of claim 9, wherein the additive is incorporated in the polymer impregnated and pyrolyzed ceramic matrix composite by filling the holes with the additive. ### Claim 12 (depends on 11) The method of claim 11, wherein the additive is incorporated during fabrication of the polymer impregnated and pyrolyzed ceramic matrix composite before pyrolysis. ### Claim 13 (depends on 12) The method of claim 12, wherein the holes are fabricated and filled by forming the additive into a desired shape, placing the additive in a die, and forming the pre-preg around the additive. ### Claim 14 (depends on 9) The method of claim 9, wherein the additive is incorporated in the polymer impregnated and pyrolyzed ceramic matrix composite after pyrolysis by filling the holes with the additive. ### Claim 15 (depends on 14) The method of claim 14, wherein the holes are fabricated after pyrolysis by a method selected from the group consisting of diamond machining, laser machining, and ultrasonic machining. ### Claim 16 (depends on 15) The method of claim 15, wherein the additive is selected from the group consisting of low dielectric constant materials and high dielectric constant materials, and the additive is incorporated into the holes by a method selected from the group consisting of sol gel methods, slurry casting, glass frit melting, inserting solid rods of the additive into the holes, and polymer derived methods. ### Claim 17 (depends on 16) The method of claim 16, further comprising forming a stable ceramic material filling the holes by heating the polymer impregnated and pyrolyzed ceramic matrix composite to a temperature of 1,000 to 1,300° C. after the holes are filled. ### Claim 18 (depends on 8) The method of claim 8, wherein pyrolyzing is carried out by heating at a temperature of 1,000 to 1,300° C. ### Claim 19 (depends on 18) The method of claim 18, wherein the composite shape is cured by heating to a temperature less than the temperature at which the composite shape is pyrolyzed. ### Claim 20 (depends on 8) The method of claim 8, wherein the open porosity of the polymer impregnated and pyrolyzed ceramic matrix composite decreases to 5 to 15 vol %. ### Claim 21 (depends on 8) The method claim 8, further comprising heating the polymer impregnated and pyrolyzed ceramic matrix composite after pyrolysis to a temperature of 800 to 1,000° C. in an oxidizing atmosphere. ### Claim 22 A method for changing the dielectric properties of a polymer impregnated and pyrolyzed ceramic matrix composite, wherein the method comprises fabricating a uniform array of holes having a diameter in the range of 0.0254 to 0.254 cm in the polymer impregnated and pyrolyzed ceramic composite, which comprises a reinforcing fiber, ceramic matrix and filler. ### Claim 23 (depends on 22) The method of claim 22, wherein the filler is a low dielectric constant material having a dielectric constant in the range of 4.0 to 7.5.