# US 6,293,853 B1 · Conditioner apparatus for chemical mechanical polishing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,293,853 B1 - Document ID: US6293853B1 - Status: Granted - Kind: B1 - Application number: 09/479,046 - Filed: 2000-01-07 - Granted: 2001-09-25 - Earliest claimed: 1997-07-11 - Assignees: Applied Materials, Inc. - Inventors: Ilya Perlov; Eugene Gantvarg - Web page: https://patentgrep.com/patent/US6293853B1 ## CPC - B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In another aspect, pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In yet another aspect, the conditioner head support arm has a fluid channel extending therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned. ## Claims ### Claim 1 An apparatus for use in substrate polishing, comprising: a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad; and a support arm for supporting the conditioner head above the polishing pad surface to be conditioned, the support and having a fluid channel extending essentially longitudinally therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and the fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the fluid channel comprises a tube for receiving the rinsing fluid and a tube for receiving air. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the tube for receiving the rinsing fluid is coupled to one or more water jets. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the support arm is coupled to a base and the fluid channel extends through the base. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the fluid channel is constructed to supply air to a fluid cavity, wherein the build-up and release of air pressure within the fluid cavity extends and retracts the conditioner head toward and away from the polishing pad surface to enable the end effector to condition the surface of the polishing pad. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the end effector includes a diamond-impregnated surface. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein a surface of the end effector includes teeth. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein a surface of the end effector includes recesses. ### Claim 9 An apparatus for use in substrate polishing, comprising: a conditioner head constructed to receive an end effector for conditioning a surface of a substrate polishing pad; a support arm extending horizontally over the surface of the polishing pad and having one end coupled to the conditioner head for supporting the conditioner head above the polishing pad surface to be conditioned, the support arm having a channel constructed to convey fluid; and a pneumatic driver coupled between the support arm and the conditioner head and constructed to receive fluid through the support arm channel and thereby to apply an actuating force to extend and retract the conditioner head toward and away from the polishing pad surface, whereby an end effector attached to the conditioner head can condition the surface of the polishing pad. ### Claim 10 (depends on 9) The apparatus of claim 9 wherein the driver is coupled between the support arm and the conditioner head to apply an actuating force to the conditioner head from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned. ### Claim 11 (depends on 9) The system of claim 9 further comprising a fluid line that extends through the support arm to supply rinsing fluid to the polishing pad surface. ### Claim 12 A method for use in substrate polishing, comprising: providing a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad; supporting the conditioner head above the polishing pad surface to be conditioned with a support arm that extends horizontally over the surface of the polishing pad; and supplying pneumatic pressure through the support arm to a pneumatic driver coupled between the conditioner head and the support arm to apply an actuating force to extend and retract the conditioner head toward and away from the polishing pad surface to enable an end effector attached to the conditioner head to condition the surface of the polishing pad. ### Claim 13 (depends on 12) The method of claim 12 wherein the conditioner head is driven with an actuating force that lies along a line from a position that is substantially normal to the polishing pad surface to be conditioned. ### Claim 14 An apparatus for use in substrate polishing, comprising: a machine base; a rotatable substrate carrier constructed to receive a substrate for polishing; a rotatable platen mounted on the machine base to support a polishing pad for polishing a surface of the substrate; a conditioner head constructed to receive an end effector for conditioning a surface of the polishing pad; a support arm having one end mounted on the machine base and another end coupled to the conditioner head to support the conditioner head above the polishing pad surface to be conditioned; and a driver coupled between the conditioner head and the support arm to apply, from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned, an actuating force for extending and retracting the conditioner head toward and away from the polishing pad surface, whereby an end effector attached to the conditioner head can condition the surface of the polishing pad. ### Claim 15 (depends on 14) The apparatus of claim 14 wherein the driver is pneumatically-driven.