# US 6,293,137 B1 · Hydrogen sensor

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- Number: US 6,293,137 B1
- Document ID: US6293137B1
- Status: Granted
- Kind: B1
- Application number: 09/564,742
- Filed: 2000-05-04
- Granted: 2001-09-25
- Earliest claimed: 2000-05-04
- Assignees: National Science Council
- Inventors: Wen-Chau Liu; Huey-lng Chen; Hsi-Jen Pan
- Web page: https://patentgrep.com/patent/US6293137B1

## CPC

- G01N 33/005: {H2}
- H10D 64/0124: {to Group III-V semiconductors}
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

In this invention, we propose a high-sensitivity Pd/InP hydrogen sensor. First, a n-type InP semiconductor membrane is grown on a semi-insulating InP substrate. The concentration and thickness of this membrane are 2×1017cm−3 and 3000 Å, respectively. Then, Pd metal and AuGe alloy are evaporated on the surface of the membrane as the anode and cathode electrodes, respectively. Due to the catalytic performance of Pd metal, the adsorbed hydrogen molecules on the surface of the Pd metal are dissociated into hydrogen atoms. The hydrogen atoms diffuse and pass through the Pd metal and form a dipole layer at the interface between the Pd metal and the n-type InP membrane. This dipole layer will decrease the depletion width of the n-type InP membrane and further lower the metal-semiconductor Schottky barrier height. Therefore, the current-voltage (I-V) characteristics will be modulated after the introduction of hydrogen gas.

## Claims

### Claim 1

A hydrogen sensor comprising:
a semiconductor substrate made of a semi-insulating InP material;
a semiconductor film made of an n-type III-V Group compound material formed on said semiconductor substrate; and
an anode and a cathode formed on a same surface of the said semiconductor film and isolated from each other, wherein a first metal as said anode forms a Schottky contact with said semiconductor film and a second metal as said cathode forms an Ohmic contact with said semiconductor film, wherein a thickness of said first metal and a material of which said first metal is made enable a Schottky barrier height of said Schottky contact to decrease when hydrogen contacts an exposed surface of said first metal.

### Claim 2 (depends on 1)

The hydrogen sensor according to claim 1, wherein the material and the thickness of said first metal enable hydrogen to be dissociated into hydrogen atoms when the hydrogen is adsorbed with the exposed surface of said first metal, and said hydrogen atoms diffuse through said first metal, so that said Schottky barrier height decreases.

### Claim 3 (depends on 1)

The hydrogen sensor according to claim 1, wherein said semiconductor film is n-type InP.

### Claim 4 (depends on 3)

The hydrogen sensor according to claim 3, wherein said n-type InP has a doping concentration of 1×1016 to 5×1017 cm−3.

### Claim 5 (depends on 3)

The hydrogen sensor according to claim 3, wherein said n-type InP has a thickness of 1000 Angstrom to 5000 Angstrom.

### Claim 6 (depends on 1)

The hydrogen sensor according to claim 1, wherein said first metal is Pd or Pd alloy.

### Claim 7 (depends on 6)

The hydrogen sensor according to claim 6, wherein said first metal is Pd.

### Claim 8 (depends on 7)

The hydrogen sensor according to claim 7, wherein said Pd has a thickness of 2000 Angstrom to 5 micron.

### Claim 9 (depends on 1)

The hydrogen sensor according to claim 1, wherein said second metal is an alloy of AuGe.

### Claim 10 (depends on 9)

The hydrogen sensor according to claim 9, wherein said alloy of AuGe has a thickness of 3000 Angstrom to 5 micron.

### Claim 11 (depends on 1)

The hydrogen sensor according to claim 1, wherein said anode has a C shape or a C-like shape, and said cathode has a shape corresponding to that of said anode, so that said cathode is encompassed by said anode.

### Claim 12 (depends on 1)

The hydrogen sensor according to claim 1, wherein said cathode has a C shape or a C-like shape, and said anode has a shape corresponding to that of said cathode, so that said anode is encompassed by said cathode.