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US 6,291,016 B1Granted
Method for increasing contact area between a viscous liquid and a substrate
AssigneeNordson Corporation
InventorsWilliam E. Donges, James C. Smith
Life of this patent
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AssigneeNordson Corporation
InventorsWilliam E. Donges, James C. Smith
Estimating the term…
A method of assembling electronic components using a dispenser having a nozzle in fluid communication with a source of viscous liquid having a high surface tension and having an air discharge passage in fluid communication with a source of pressurized air. A droplet of the viscous liquid is dispensed from the nozzle onto a printed circuit board to form an initial contact area between the droplet and the printed circuit board and the high surface tension of the droplet causes the initial contact area to remain substantially constant. A burst of air is then discharged from the air discharge passage for impinging the droplet after the droplet contacts the printed circuit board, which increases the initial contact area between the droplet and the printed circuit board.
A method of assembling electronic components using a dispenser having a nozzle in fluid communication with a source of viscous liquid having a high surface tension and further having an air discharge passage in fluid communication with a source of pressurized air, the method comprising:
A method of assembling electronic components using a dispenser having a nozzle in fluid communication with a source of viscous liquid having a high surface tension and further having an air discharge passage in fluid communication with a source of pressurized air, the method comprising:
A method of assembling electronic components using a dispenser having a nozzle in fluid communication with a source of solder flux having a high surface tension and further having an air discharge passage in fluid communication with a source of pressurized air, the method comprising:
Dependencies are inferred from the claim text.