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US 6,289,580 B1Granted
Surface mount power supply device
AssigneeLambda Electronics, Inc.
InventorPeter T. Brune
Life of this patent
Estimating the term…
Abstract
The present invention relates to a method and apparatus for manufacturing a surface mount power supply device having effective thermal management. The surface mount power supply device comprises a printed circuit board mounted to a thermal plastic lead frame attach by means of vertically-extending aluminum pins embedded in the lead frame attach. A cylindrical member is centered within the lead frame attach by means of inwardly protruding arms transversely connected to the lead frame attach to allow for a pick-and-place operation.
Claims10
A method for manufacturing a surface mount device, comprising the steps of:
- soldering an electronic component having a plurality of leads to a top surface of a printed circuit board having a plurality of solder pads corresponding to each of the leads, wherein the printed circuit board comprises a metal base plate having the top surface and a bottom surface, the top surface further having an electrically conductive circuitry attached thereto by a thermally conductive bonding agent;
- inserting a plurality of electrically conductive pins vertically-extending from a lead frame into a plurality of holes corresponding to each of the pins, the holes being located on the top surface of the printed circuit board, the pins having respective ends for electrical surface mount connection to a second printed circuit board;
- and
- reflowing the lead frame to the first mentioned printed circuit board.
1 more element
Dependencies are inferred from the claim text.