US 6,289,204 B1Granted

Integration of a receiver front-end in multilayer ceramic integrated circuit technology

AssigneeMotorola, Inc.

InventorsJohn Estes, Rong-Fong Huang, Rich Kommrusch

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Abstract

A multilayer ceramic integrated circuit module for a receiver front-end of a wireless communication device is provided. The module contains an embedded component portion, which has a plurality of thick film capacitors; a plurality of multilayer capacitors; and a plurality of transmission lines deposited internal to the multilayer ceramic integrated circuit module to interconnect the plurality of thick film capacitors and the plurality of multilayer capacitors. The module also contains a mounted component portion, which has a pair of pin diodes; a transistor and a plurality of resistors coupled thereto, for controlling the bias of the pair of pin diodes; and a low-noise-amplifier. The module reduces the size and weight of wireless devices and combines multiple functions into a highly integrated device.

Claims5

Dependent claims

A multilayer ceramic module housing a receiver front-end of a wireless communication device, comprising:

first ceramic material including at least two layers;
dc bias circuitry and control lines embedded within the first ceramic material;
second ceramic material including a plurality of layers;
radio frequency devices including receiving and transmitting electronic devices, embedded within the second ceramic material;
and
a first embedded ground plane, for providing RF shielding, positioned between the dc bias circuitry and control lines and the radio frequency devices, wherein the radio frequency devices include a three dimensional transmission line comprising a plurality of layered components, each located between layers of the second ceramic material;
and at least two connecting components within the second ceramic material connected to each of the layered components.

4 more elements

Dependencies are inferred from the claim text.