Semiconductor device and process for manufacturing the same
AssigneesHitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.
InventorsToshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
Life of this patent
Estimating the term…
Abstract
A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.
Claims40
A memory module comprising:
- a semiconductor chip including a word structure switching external terminal for selecting a word structure in dependence upon the state of a word structure switching signal;
- and
- a dedicated printed-wiring substrate with said semiconductor chip mounted thereon and including dedicated lines external to said semiconductor chip corresponding to the switched word structure of said semiconductor chip.
A memory module comprising:
- a wiring substrate having arranged lines;
- a semiconductor chip;
- a function switching circuit;
- and
- word structure setting lines,
- wherein said semiconductor chip is mounted on said wiring substrate and includes a function switching terminal for switching an internal function and a word structure switching terminal for selecting a word structure, and
- wherein said function switching circuit is electrically connected with the function switching terminal of said semiconductor chip and is arranged on said wiring substrate external to said semiconductor chip.
A memory module comprising:
- a wiring substrate having interconnections;
- a semiconductor chip;
- a function switching circuit;
- and
- word structure switching lines,
- wherein said semiconductor chip is mounted on said wiring substrate and includes a function switching terminal for selecting an internal function and a word structure switching terminal for selecting a word structure,
- wherein said function switching circuit is connected with the function switching terminal of said semiconductor chip and is arranged on said wiring substrate external to said semiconductor chip, and
- wherein said word structure switching circuit is electrically connected with said word structure switching terminal and arranged on said wiring substrate external to said semiconductor chip.
A memory module comprising:
- a wiring substrate having interconnections;
- a semiconductor chip;
- a function setting circuit;
- and
- a word structure setting circuit,
- wherein said semiconductor chip is mounted on said wiring substrate and includes a function switching terminal for selecting a function and a word structure switching terminal for selecting a word structure,
- wherein said function setting circuit is connected with the function switching terminal of said semiconductor chip and is arranged on said wiring substrate external to said semiconductor chip, and
- wherein said word structure setting circuit is electrically connected with said word structure switching terminal and arranged on said wiring substrate external to said semiconductor chip.
A memory module comprising:
- a module substrate;
- a semiconductor chip on said module substrate, said semiconductor chip including a plurality of memory cells and an external terminal;
- and
- means for selecting one of a plurality of word structures of said semiconductor chip by controlling a state of said external terminal of said semiconductor chip, said means for selecting being outside of said semiconductor chip.
A memory module comprising:
- a module substrate;
- a semiconductor chip on said module substrate, said semiconductor chip including a plurality of memory cells and an external terminal;
- and
- means for selecting the number of input/output data of said semiconductor chip by controlling a state of said external terminal of said semiconductor chip, said means for selecting being outside of said semiconductor chip.
Dependencies are inferred from the claim text.