Conductive via feed through for double-sided modules
AssigneeStellex Microwave Systems, Inc.
InventorsEric Franklyn Richardson, David Andrew Verdon, Brett Armstrong Kelley
Life of this patent
Estimating the term…
Abstract
A double-sided module is provided having electrical substrates on either side of a panel housing which are interconnected by a wire connection from one substrate to a conductor-filled through-channel, or via, in the other substrate. The distances from the bonding point on one substrate to the bond vias have to have predetermined ratios of heights to center-to-center distances to avoid failure under ultra high acceleration. A ratio of under 20 to 1 is required to avoid failure under 5,000 gravities of acceleration for a 0.0008 inch diameter wire and under 8.3 to 1 for a 0.002 inch diameter wire.
Claims20
A double-sided module comprising:
- a housing having an opening provided therein;
- a first substrate secured to said housing and having a bonding pad thereon adjacent to said opening in said housing;
- a second substrate disposed on the opposite side of said housing having a via disposed therein adjacent to said opening in said housing;
- and
- a connection between said bonding pad and said via through said opening in said housing.
A double-sided module comprising:
- a housing having an internally extending integral housing panel having a housing opening provided therein;
- a first substrate secured to said housing and having a first substrate opening provided therein and a bonding pad thereon adjacent to said first substrate opening;
- a second substrate disposed on the opposite side of said integrally extending integral housing and having a via disposed therein adjacent to said opening in said housing;
- and
- a wire connection between said bonding pad and said via through said housing opening.
Dependencies are inferred from the claim text.