High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief

A high density integrated circuit module comprising:

• a plurality of level-one integrated circuit devices, each said level-one device including an integrated circuit die, a rectangular casing surrounding said die, said casing having an upper major surface and a perimeter edge and a plurality of electrical leads having first and second major surfaces, the electrical leads extending from said die through the perimeter edge of the casing;
• and
• a rail assembly on each of at least two sides of the module, comprised of non-linear and linear rails, at least one of which rails has a partial aperture into the opening of which an electrical lead from one of the level-one devices is projected, the rail assembly being connected in an interconnection network to the electrical leads to provide selected electrical interconnection amongst the level-one integrated circuit devices, the rail assembly having a substrate mounting portion comprised of alloy 110.

A high density integrated circuit module mounted on a substrate, the module comprising:

• a plurality of level-one integrated circuit devices, each said level-one device including an integrated circuit die, a rectangular casing surrounding said die, said casing having an upper major surface and a perimeter edge and a plurality of electrical leads having first and second major surfaces, the electrical leads extending from said die through the perimeter edge of the casing and in which the distance from the first major surface of the electrical leads of the level-one device closest to the substrate to the surface of the substrate is at least 0.030 inches;
• and
• a rail assembly connected in an interconnection network to the electrical leads to provide selected electrical interconnection amongst the level-one integrated circuit devices, the rail assembly having a substrate mounting portion comprised of alloy 110.