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US 6,288,904 B1Granted
Chip module, in particular for implantation in a smart card body
AssigneeInfineon Technologies AG
InventorsDetlef Houdeau, Peter Stampka, Michael Huber, Josef Heitzer
Life of this patent
Estimating the term…
Abstract
The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.
Claims17
A chip module, comprising:
- a carrier and a chip disposed on said carrier;
- a plurality of conductor tracks on said carrier;
- said carrier being formed with a pedestal-type elevation running at least partly around said chip, said elevation being produced in concomitant production steps together with said electric conductor tracks, said electric conductor tracks forming a constituent part of said elevation at mutual intersection points where said electric conductor tracks encounter said elevation, and said elevation forming interruptions disposed such that parts of said elevation formed by said electric conductor tracks cannot be short-circuited by parts of said elevation not formed by said electric conductor tracks.
Dependencies are inferred from the claim text.