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US 6,288,900 B1Granted
Warpage compensating heat spreader
AssigneeInternational Business Machines Corporation
InventorsEric A. Johnson, Seungbae Park
Life of this patent
Estimating the term…
Abstract
A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.
Claims24
An electronic package, comprising:
- a chip or integrated circuit disposed upon an organic, laminated substrate, and bonded thereto by solder balls;
- and
- a heat spreader disposed over said chip or integrated circuit and extending beyond a periphery of said chip or integrated circuit, said heat spreader comprising sections having relatively different coefficients of thermal expansion and contraction, whereby warpages in said electronic package are reduced.
An electronic package, comprising:
- a chip or integrated circuit disposed upon and bonded to an organic, laminated substrate by solder balls;
- and
- a heat spreader disposed over, and extending past a periphery of said chip or integrated circuit and comprising sections having relatively different stiffness whereby warpages in said electronic package are reduced by balancing the stiffness and the coefficient of thermal expansion of the substrate independently above said chip and beyond said periphery thereof.
An electronic package, comprising:
- a chip or integrated circuit disposed upon, and bonded by solder balls to and organic substrate;
- and
- a heat spreader disposed over, and extending past a periphery of said chip or integrated circuit and comprising at least two layers of different materials, at least one of said layers of different materials extending beyond said periphery of said chip, whereby warpages in said electronic package are reduced.
Dependencies are inferred from the claim text.