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US 6,288,896 B1Granted
Heat dissipation system for a laptop computer using a heat pipe
AssigneeAcer Incorporated
InventorRichard T. Hsu
Life of this patent
Estimating the term…
Abstract
The present invention provides heat dissipation systems for use in hinged computing devices which includes a thermally conductive joint (36). The joint has first and second receptacles (104, 108) which are generally parallel to and adjacent one another. A first heat pipe (22) is at least partially disposed within the first receptacle and is adapted to be thermally coupled to a heat source within the hinged computing device. A second heat pipe (30) is at least partially disposed within the second receptacle and is adapted to be thermally coupled to a heat sink. The thermally conductive joint permits the transfer of heat from the first heat pipe to the second heat pipe to transfer heat from the heat source to the heat sink portion of the hinged computing device.
Claims31
A hinged computer, comprising:
- a base comprising a processor and a first heat pipe, said first heat pipe and said processor being thermally coupled;
- a lid assembly hingedly connected to said base, said lid assembly comprising a second heat pipe and a display;
- a thermally conductive joint, said joint having first and second receptacles, said first receptacle being generally parallel to and adjacent said second receptacle;
- wherein an end of said first heat pipe is positioned within said first receptacle and an end of said second heat pipe is positioned within said second receptacle to thermally couple said ends and said joint;
- and
- wherein at least a portion of said display is proximate said second heat pipe, said second heat pipe configured to transfer at least some heat from said processor to said display to facilitate operation of said display.
3 more elements
A hinged computer, comprising:
- a base comprising,
- a heat-producing electronic component;
- a thermally conductive chassis, said chassis being integrally formed with a first joint portion;
- a heat spreader thermally coupled with said electronic component and at least partially enclosing said electronic component;
- and
- a first heat pipe operably attached to said heat spreader and thermally coupled with said electronic component, said first heat pipe having an end that is thermally coupled with said first joint portion;
- and
- a lid assembly hingedly connected to said base forming a hinge axis, said lid assembly comprising,
- a thermally conductive panel, said panel being integrally formed with a second joint portion;
- a liquid crystal display;
- and
- a second heat pipe thermally coupled with said panel, said second heat pipe having an end that is thermally coupled with said second joint portion, and at least a portion of said second heat pipe being thermally coupled to a portion of said display;
- wherein said first and said second joint portions are operably attached to one another to thermally couple said first and said second heat pipes;
- and
- wherein said second heat pipe and display are positioned such that said second heat pipe provides sufficient heat to said display to reduce by about thirty (30) percent said amount of energy otherwise needed by said display from a computer battery.
12 more elements
A hinged computer, comprising:
- a base comprising,
- a heat-producing electronic component;
- a thermally conductive chassis, said chassis being integrally formed with a first joint portion;
- a heat spreader thermally coupled with said electronic component and at least partially enclosing said electronic component;
- and
- a first heat pipe operably attached to said heat spreader and thermally coupled with said electronic component, said first heat pipe having an end that is thermally coupled with said first joint portion;
- and
- a lid assembly hingedly connected to said base forming a hinge axis, said lid assembly comprising,
- a thermally conductive panel, said panel being integrally formed with a second joint portion;
- a liquid crystal display;
- and
- a second heat pipe thermally coupled with said panel, said second heat pipe having an end that is thermally coupled with said second joint portion, and at least a portion of said second heat pipe being thermally coupled to a portion of said display;
- wherein said first and said second joint portions are operably attached to one another to thermally couple said first and said second heat pipes;
- and
- wherein said display further comprises a CCF backlight tube, said second heat pipe positioned to transfer at least some heat to said backlight tube.
12 more elements
A hinged computer, comprising:
- a base comprising,
- a heat-producing electronic component;
- a thermally conductive chassis, said chassis being integrally formed with a first joint portion;
- a heat spreader thermally coupled with said electronic component and at least partially enclosing said electronic component;
- and
- a first heat pipe operably attached to said heat spreader and thermally coupled with said electronic component, said first heat pipe having an end that is thermally coupled with said first joint portion;
- and
- a lid assembly hingedly connected to said base forming a hinge axis, said lid assembly comprising,
- a thermally conductive panel, said panel being integrally formed with a second joint portion;
- a liquid crystal display;
- and
- a second heat pipe thermally coupled with said panel, said second heat pipe having an end that is thermally coupled with said second joint portion, and at least a portion of said second heat pipe being thermally coupled to a portion of said display;
- wherein said first and said second joint portions are operably attached to one another to thermally couple said first and said second heat pipes;
- and
- wherein said second heat pipe is adapted to raise a temperature of said portion of said display by about 10 degrees Celsius.
12 more elements
Dependencies are inferred from the claim text.