Ceramic electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuhiro Yoshida, Nobushige Moriwaki, Yasuhiko Kubota
Life of this patent
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Abstract
A ceramic electronic component satisfies a condition expressed by H1≧0.03L, wherein H1is the distance between the surface of a substrate on which the ceramic electronic component is mounted and a point P at which outer terminals connecting the ceramic electronic component to the substrate first contacts the side surfaces of the ceramic electronic component and L is the length of the ceramic electronic component. The ceramic electronic component also satisfies a condition expressed by H2≧2t wherein H2is the distance from a lower surface of the ceramic electronic element 4 to the surface of the substrate 7 and t is the thickness of the outer terminals.
Claims28
A ceramic electronic component, comprising:
- a substantially rectangular ceramic electronic component having opposite end surfaces defined by respective outer electrodes which are substantially parallel to one another and are spaced apart by a length L, the electronic component also having a bottom surface extending between the end surfaces substantially perpendicularly thereto;
- a pair of outer terminals connected to respective ones of the opposite end surfaces of the electronic component, each of the outer terminals extending below the bottom surface of the electronic component and terminating in surface mounting portions whose bottom surfaces extend in a common plane lying substantially parallel to the bottom surface of the electronic component, the distance from the common plane to the point at which the outer terminals first contact the end surfaces of the electronic component being H1, the distance from the common plane to the bottom surface of the electronic component being H2, each of the outer terminals having a thickness t,
- the electronic component and outer terminals having the relationship:
- H1≧0.03L and H2≧2t.
The combination of a ceramic electronic component and a substrate, the combination comprising:
- a substrate having a substantially planar mounting surface;
- a substantially rectangular ceramic electronic component having opposite end surfaces defined by respective outer electrodes which are substantially parallel to one another and are spaced apart by a length L, the electronic component also having a bottom surface extending between the end surfaces substantially perpendicularly thereto;
- a pair of outer terminals connected to respective ones of the opposite end surfaces of the electronic component, each of the outer terminals extending below the bottom surface of the electronic component and being coupled to the mounting surface of the substrate, the distance from the mounting surface of the substrate to the point at which the outer terminals first contact the end surfaces of the electronic component being H1, the distance from the planar substrate to the bottom surface of the electronic component being H2, each of the outer terminals having a thickness t,
- the electronic component, the outer terminals and the mounting surface of the substrate having the relationship:
- H1≧0.03L and H2≧2t.
Dependencies are inferred from the claim text.