# US 6,288,821 B1 · Hybrid electro-optic device with combined mirror arrays > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,288,821 B1 - Document ID: US6288821B1 - Status: Granted - Kind: B1 - Application number: 09/410,586 - Filed: 1999-10-01 - Granted: 2001-09-11 - Earliest claimed: 1999-10-01 - Assignees: Lucent Technologies Inc. - Inventors: Vladimir Anatolyevich Aksyuk; David John Bishop; Cristian A. Bolle; John VanAtta Gates, II; Randy Clinton Giles; Ronald Edward Scotti - Web page: https://patentgrep.com/patent/US6288821B1 ## CPC - G02B 26/0816: {by means of one or more reflecting elements} - G02B 6/3512: {the optical element being reflective, e.g. mirror} - G02B 6/3556: {NxM switch, i.e. regular arrays of switches elements of matrix type constellation} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10S 359/904: Micromirror - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract An optical signal processing apparatus includes at least two mirror array chips mounted on an upper surface of a base in close proximity to each other to form a compound array. Each mirror array chip includes a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate. The mirrors are movable in response to an electrical signal. A plurality of electrical leads for conduct the electrical signals to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base. ## Claims ### Claim 1 An optical signal processing apparatus which comprises: a) a base; and, b) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a silicon substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the silicon substrate, the mirrors being movable in response to an electrical signal, and a plurality of electrical leads for conducting the electrical signal to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the silicon substrate and the upper surface of the base. ### Claim 2 (depends on 1) The apparatus of claim 1 wherein the compound array includes at least 1,000 mirrors. ### Claim 3 An optical signal processing apparatus which comprises: a) a base; and, b) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors each being individually movable in response to an electrical signal, and a plurality of electrical leads for conducting the electrical signal to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base, wherein four mirror array chips are mounted to the upper surface of the base. ### Claim 4 (depends on 3) The apparatus of claim 3 wherein each mirror array chip includes up to 256 mirrors. ### Claim 5 (depends on 1) The apparatus of claim 1 wherein the apparatus includes at least two lead wires for each mirror. ### Claim 6 An optical signal processing apparatus which comprises: a) a base; and, b) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors being movable in response to an electrical signal, and a plurality of electrical leads for conducting the electrical signal to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base, wherein the apparatus includes at least four lead wires for each mirror. ### Claim 7 (depends on 6) The apparatus of claim 6 wherein the lead wires extend to a peripheral edge of the base and fan outward so as to be more spaced apart from each other in the vicinity of the base than in the vicinity of the mirror array chips. ### Claim 8 (depends on 1) The apparatus of claim 1 wherein the mirrors range in diameter from about 100 μm to about 1,000 μm. ### Claim 9 (depends on 1) The apparatus of claim 1 wherein the mirrors are spaced apart from each other a distance of from about 100 μm to about 1,000 μm. ### Claim 10 An optical signal processing apparatus which comprises: a) a base; and, b) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors each being individually movable in response to an electrical signal, and a plurality of electrical leads for conducting the electrical signal to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base, wherein the lead wires are sufficiently sized and spaced to carry a voltage of up to about 150 volts. ### Claim 11 (depends on 1) The apparatus of claim 1 wherein the base is fabricated from silicon. ### Claim 12 An electro-optic signal processing assembly which comprises: a) an optical signal processing apparatus which includes i) a base, and ii) at least two mirror array chips mounted on an upper surface of the base in close proximity to each other to form a compound array, each mirror array chip including a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate, the mirrors being movable in response to respectively directed electrical signals, and a plurality of electrical leads for conducting the electrical signals to the respective mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base; b) a plurality of optical fibers for individually conveying light beams to respective mirrors of the mirror array chips; c) a plurality of receptors for individually receiving light beams reflected by respective mirrors of the mirror array chips; and d) at least one electrical circuit for processing electrical signals to be conducted by the electrical leads to the respective mirrors, wherein the optical signal processing apparatus includes at least four electrical leads for each mirror. ### Claim 13 (depends on 12) The assembly of claim 12 wherein the plurality of receptors for individually receiving light beams comprises a second plurality of optical fibers. ### Claim 14 (depends on 12) The assembly of claim 12 wherein the compound array includes at least 1,000 mirrors. ### Claim 15 (depends on 14) The assembly of claim 14 wherein the compound array includes four mirror array chips, each mirror array chip possessing 256 mirrors. ### Claim 16 (depends on 12) The assembly of claim 12 wherein the at least two mirror array chips define a first layer, the base defines a second layer, and the assembly further includes a wafer having a surface to which the base is affixed, the wafer defining a third layer and including at least a portion of the electrical circuit for processing electrical signals. ### Claim 17 (depends on 16) The assembly of claim 16 further including a fourth layer to which the wafer is affixed, the fourth layer including at least a portion of the electrical circuit for processing electrical signals. ### Claim 18 (depends on 17) The assembly of claim 17 wherein the base and the wafer are fabricated from silicon.